Details
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| Parameter | Description | Value |
|---|---|---|
| Part Number | High Speed CMOS Schmitt Trigger Inverter | HC14 |
| Function | Inverter | Single |
| Logic Family | CMOS | High Speed |
| Supply Voltage | Operating Range | 2V to 6V |
| Input Voltage | High Level | VDD - 1.5V |
| Input Voltage | Low Level | 0.8V |
| Output Voltage | High Level | VDD - 0.1V |
| Output Voltage | Low Level | 0.1V |
| Propagation Delay | Typical at VDD = 5V | 9ns |
| Power Dissipation | Maximum per Package | 100mW |
| Operating Temperature | Commercial Range | 0掳C to 70掳C |
| Industrial Temperature | Range | -40掳C to 85掳C |
| Storage Temperature | Range | -65掳C to 150掳C |
| Package Type | DIP-14, SOIC-14 |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage (VDD) is within the operating range of 2V to 6V.
- Connect VDD to the positive power supply and GND to the ground.
Input Signal:
- Apply input signals to the designated input pin.
- Ensure the input signal levels are within the specified high and low voltage ranges.
Output Signal:
- The output will be the inverted version of the input signal.
- Check the output voltage levels to ensure they meet the specified high and low levels.
Propagation Delay:
- Measure the propagation delay to ensure it meets the typical value of 9ns at VDD = 5V.
Power Dissipation:
- Do not exceed the maximum power dissipation of 100mW per package to avoid overheating.
Temperature Considerations:
- Operate the device within the specified temperature ranges to ensure reliable performance.
- Store the device in an environment within the storage temperature range to prevent damage.
Package Handling:
- Handle the package with care to avoid physical damage.
- Follow proper ESD (Electrostatic Discharge) precautions to prevent damage to the device.
Mounting:
- Ensure proper mounting and soldering techniques to maintain the integrity of the connections.
- Use appropriate tools and equipment for mounting the device on the PCB.
Testing:
- Test the device under normal operating conditions to verify its functionality.
- Refer to the datasheet for detailed testing procedures and specifications.
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