Details
BUY MUR1100E https://www.utsource.net/itm/p/12607229.html
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM | 1000 | V |
| Maximum RMS Voltage (Non-Inductive Load) | VRMS | 707 | V |
| Maximum DC Blocking Voltage | VDC | 1000 | V |
| Maximum Average Rectified Forward Current | IFSM | 1 | A |
| Maximum RMS Forward Current (Non-Inductive Load) | IRMS | 0.707 | A |
| Maximum Non-Repetitive Peak Surge Current (Half Sine-Wave, 10 ms) | IFSM | 30 | A |
| Maximum Operating Junction Temperature | TJ(MAX) | 150 | 掳C |
| Storage Temperature Range | TSTG | -65 to 150 | 掳C |
| Forward Voltage Drop at Rated Current (IF = 1A) | VF | 1.1 | V |
| Reverse Recovery Time | trr | 75 | ns |
| Power Dissipation at 25掳C | PD | 1.1 | W |
Instructions for Use:
Mounting:
- Ensure proper heat dissipation by mounting the MUR1100E on a heatsink if operating at high currents or in high ambient temperatures.
- Use thermal paste between the device and the heatsink for better thermal conductivity.
Electrical Connections:
- Connect the anode and cathode terminals correctly to avoid reverse polarity, which can lead to device failure.
- Use short and thick leads to minimize inductance and resistance, especially in high-frequency applications.
Thermal Management:
- Monitor the junction temperature to ensure it does not exceed 150掳C. Excessive temperature can degrade performance and lifespan.
- Consider derating the current if operating in environments with high ambient temperatures.
Surge Handling:
- The MUR1100E can handle peak surge currents up to 30A for short durations (half sine-wave, 10 ms). Ensure that the circuit design accounts for these surges to prevent damage.
Storage:
- Store the device in a dry, cool place within the temperature range of -65掳C to 150掳C.
- Avoid exposure to corrosive environments or excessive humidity.
Handling:
- Handle the device with care to avoid mechanical stress, which can cause internal damage.
- Use appropriate ESD protection measures to prevent static discharge damage.
Testing:
- Before final assembly, test the device to ensure it meets the specified parameters.
- Use a multimeter or appropriate testing equipment to verify forward and reverse characteristics.
Compliance:
- Ensure that the application complies with relevant safety and regulatory standards, such as UL, CE, and RoHS.
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