Details

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BUY HEF4044 https://www.utsource.net/itm/p/12607247.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VDD	3	-	15	V	-
Input Low Voltage	VIL	-	-	0.8	V	VDD = 5V
Input High Voltage	VIH	2.0	-	-	V	VDD = 5V
Output Low Voltage	VOL	0.4	0.5	0.6	V	IOL = 0.4mA, VDD = 5V
Output High Voltage	VOH	2.7	3.5	4.5	V	IOH = -0.4mA, VDD = 5V
Input Leakage Current	IIL	-1	-	1	渭A	VDD = 0 to 15V
Output Leakage Current	IOL	-1	-	1	渭A	VDD = 0 to 15V
Propagation Delay Time	tpd	12	-	36	ns	VDD = 5V, fL = 1kHz, CL = 15pF
Power Dissipation	PD	-	-	100	mW	Per Package
Operating Temperature Range	TA	-40	-	85	掳C	-

Instructions for Use:

1. Power Supply:

   • The HEF4044 can operate with a supply voltage (V_DD) ranging from 3V to 15V.
   • Ensure that the power supply is stable and within the specified range to avoid damage to the device.

2. Input Levels:

   • For reliable operation, input voltages should be kept within the specified limits.
   • Input low voltage (V_IL) should not exceed 0.8V when V_DD is 5V.
   • Input high voltage (V_IH) should be at least 2.0V when V_DD is 5V.

3. Output Levels:

   • Output low voltage (V_OL) should be below 0.6V when sourcing 0.4mA and V_DD is 5V.
   • Output high voltage (V_OH) should be above 2.7V when sinking -0.4mA and V_DD is 5V.

4. Leakage Current:

   • Both input and output leakage currents should be kept within 卤1渭A to ensure proper operation.

5. Propagation Delay:

   • The propagation delay time (t_pd) is typically between 12ns and 36ns under standard conditions (V_DD = 5V, f_L = 1kHz, C_L = 15pF).

6. Power Dissipation:

   • The maximum power dissipation per package is 100mW. Ensure adequate heat dissipation if operating near this limit.

7. Operating Temperature:

   • The device can operate over a temperature range from -40掳C to 85掳C. Ensure that the ambient temperature does not exceed these limits to prevent thermal damage.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Use appropriate ESD protection measures during handling and installation.

9. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat.

10. Soldering:

    • Use a soldering iron with a temperature not exceeding 300掳C and complete the soldering process quickly to avoid thermal stress on the device.

(For reference only)