Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Collector-Emitter Voltage | VCE(max) | - | - | 600 | V | - |
| Collector Current | IC(max) | - | - | 50 | A | Pulse, tp = 10 渭s |
| Power Dissipation | PT(max) | - | - | 1250 | W | Case Temp. TC = 25掳C |
| Junction Temperature | TJ(op) | - | - | 150 | 掳C | - |
| Storage Temperature | TSTG | -40 | - | 150 | 掳C | - |
| Gate Emitter Voltage | VGE(th) | 3.5 | 5 | 7 | V | IG = 1 mA |
| Turn-On Time | ton | - | 0.15 | 0.3 | 渭s | IC = 25 A, VGE = 15 V |
| Turn-Off Time | toff | - | 0.15 | 0.3 | 渭s | IC = 25 A, VGE = 15 V |
| Total Switching Time | td | - | 0.3 | 0.6 | 渭s | IC = 25 A, VGE = 15 V |
Instructions for Use:
Mounting and Handling:
- Ensure proper heat sinking to maintain the junction temperature within the specified limits.
- Handle with care to avoid damage to the gate terminal, which is sensitive to electrostatic discharge (ESD).
Biasing and Drive:
- Apply a sufficient gate-emitter voltage (VGE) to ensure reliable turn-on.
- Use a gate resistor to limit the current and protect the gate from overvoltage.
Thermal Management:
- Monitor the case temperature to prevent overheating, especially under continuous high-power operation.
- Consider forced air cooling or liquid cooling for high-power applications.
Pulse Operation:
- For pulse applications, ensure that the pulse duration does not exceed the maximum allowable time to avoid thermal runaway.
Storage:
- Store the device in a dry, cool environment to prevent moisture damage.
- Avoid exposure to extreme temperatures outside the storage range.
Testing:
- Use appropriate test equipment and procedures to avoid damaging the device during testing.
- Refer to the datasheet for specific test conditions and methods.
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