BZX84B8V2LT1G

BZX84B8V2LT1G


Specifications
SKU
12607299
Details

BUY BZX84B8V2LT1G https://www.utsource.net/itm/p/12607299.html

Parameter Symbol Min Typical Max Unit
Reverse Breakdown Voltage VBR - 8.2 - V
Maximum Reverse Current IR - 5 - 渭A
Power Dissipation PT - 400 - mW
Operating Junction Temperature TJ -55 - 150 掳C
Storage Temperature TSTG -65 - 150 掳C
Capacitance CJ0 - 450 - pF
Thermal Resistance, Junction to Ambient R胃JA - 220 - K/W

Instructions for Use:

  1. Mounting and Handling:

    • Handle the BZX84B8V2LT1G with care to avoid mechanical stress.
    • Ensure proper mounting to maintain thermal performance, especially if operating near maximum power dissipation.
  2. Electrical Connections:

    • Connect the cathode (K) and anode (A) terminals correctly to avoid reverse polarity damage.
    • Use appropriate wire gauges to minimize resistance and voltage drop.
  3. Thermal Management:

    • Ensure adequate heat sinking if the device is expected to dissipate significant power.
    • Monitor the junction temperature to stay within the specified limits to prevent thermal runaway.
  4. Overvoltage Protection:

    • The BZX84B8V2LT1G is designed to provide overvoltage protection. Ensure that the reverse breakdown voltage (VBR) is not exceeded under normal operating conditions.
  5. Storage:

    • Store the device in a dry, cool environment within the specified storage temperature range to ensure long-term reliability.
  6. Testing:

    • When testing the device, use a constant current source to avoid exceeding the maximum power dissipation.
    • Measure the reverse breakdown voltage using a high-impedance voltmeter to avoid loading the circuit.
  7. Soldering:

    • Use a soldering iron with a temperature setting appropriate for the device to avoid thermal shock.
    • Solder quickly to minimize exposure to high temperatures.
  8. Compliance:

    • Ensure that the device complies with all relevant safety and regulatory standards for the application.
(For reference only)

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