Details

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BUY SN75162BN. https://www.utsource.net/itm/p/12607316.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Continuous operation	4.5	-	5.5	V
Output Current (Source)	IOH	VOH = 2.4V, TA = 25掳C	-	200	-	mA
Output Current (Sink)	IOL	VOL = 0.4V, TA = 25掳C	-	200	-	mA
Input High Voltage	VIH	-	2.0	-	5.5	V
Input Low Voltage	VIL	-	0	-	0.8	V
Output High Voltage	VOH	IOH = -10mA, TA = 25掳C	2.4	-	-	V
Output Low Voltage	VOL	IOL = 10mA, TA = 25掳C	-	-	0.4	V
Propagation Delay Time	tpd	VCC = 5V, TA = 25掳C	-	35	-	ns
Power Dissipation	PD	Continuous operation, TA = 25掳C	-	-	350	mW
Operating Temperature	TA	-	-40	-	85	掳C
Storage Temperature	TSTG	-	-65	-	150	掳C

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.

2. Output Current:

   • The device can source or sink up to 200mA per output. Ensure that the load does not exceed this limit to prevent overheating or damage.

3. Input Voltage Levels:

   • For proper logic recognition, ensure input high voltages are between 2.0V and 5.5V, and input low voltages are between 0V and 0.8V.

4. Output Voltage Levels:

   • When sourcing current, the output high voltage should be at least 2.4V. When sinking current, the output low voltage should be no more than 0.4V.

5. Propagation Delay:

   • The propagation delay time is typically 35ns under standard conditions (V_CC = 5V, T_A = 25掳C). This is important for timing considerations in your circuit.

6. Power Dissipation:

   • The maximum power dissipation is 350mW. Ensure adequate heat dissipation if operating near this limit to prevent thermal shutdown or damage.

7. Operating and Storage Temperature:

   • The device can operate in temperatures ranging from -40掳C to 85掳C. For storage, the temperature range is -65掳C to 150掳C.

8. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow proper soldering techniques to avoid thermal shock and mechanical stress.

9. Mounting and Layout:

   • Ensure proper PCB layout to minimize noise and interference. Use decoupling capacitors close to the power pins to stabilize the supply voltage.

10. Testing and Troubleshooting:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications.
    • If issues arise, check for correct power supply, signal integrity, and proper connections.

(For reference only)