Details

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BUY LXT905LC https://www.utsource.net/itm/p/12607347.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VDD	2.7	3.6	5.5	V
Output Current	IO	-	10	20	mA	Continuous
Peak Output Current	IOP	-	30	40	mA	Pulse (10% duty cycle)
Output Voltage Drop	VD	-	0.2	0.5	V	At 20mA
Operating Temperature	TOPR	-40	-	85	掳C	Storage: -65 to 150掳C
Quiescent Current	IQ	-	1	2	渭A	VDD = 3.6V, No load
Reverse Current	IR	-	1	10	渭A	VDD = 0V, VOUT = 5.5V
Thermal Resistance	胃JA	-	150	-	掳C/W	Tc = 25掳C, Free air

Instructions for Use:

1. Supply Voltage (VDD):

   • Ensure the supply voltage is within the range of 2.7V to 5.5V.
   • Avoid exceeding the maximum voltage to prevent damage to the device.

2. Output Current (IO):

   • The continuous output current should not exceed 20mA.
   • For pulse applications, the peak output current can go up to 40mA with a 10% duty cycle.

3. Output Voltage Drop (VD):

   • The voltage drop across the output should be considered when designing the circuit. It typically ranges from 0.2V to 0.5V at 20mA.

4. Operating Temperature (TOPR):

   • The device is designed to operate within a temperature range of -40掳C to 85掳C.
   • Store the device in temperatures ranging from -65掳C to 150掳C.

5. Quiescent Current (IQ):

   • The quiescent current is very low, typically around 1渭A at 3.6V supply voltage with no load.
   • This makes the device suitable for battery-powered applications.

6. Reverse Current (IR):

   • When the supply voltage is 0V and the output voltage is 5.5V, the reverse current should not exceed 10渭A.

7. Thermal Resistance (胃JA):

   • The thermal resistance from junction to ambient is 150掳C/W.
   • Ensure proper heat dissipation if the device will be operating under high power conditions.

Additional Notes:

• Always refer to the datasheet for the most accurate and detailed information.
• Proper PCB layout and component placement can help in achieving optimal performance and reliability.

(For reference only)