Details

---

BUY MAX232N. https://www.utsource.net/itm/p/12607378.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	VCC	4.75	5.0	5.25	V	Operating range for standard operation
Operating Temperature	Topr	-40		85	掳C	Industrial temperature range
Output Current (Tx)	Iout		10		mA	Maximum output current per driver
Input Current (Rx)	Iin		1		mA	Maximum input current per receiver
Data Rate	fdata		20		kbps	Maximum data rate for reliable operation
Capacitors	C1, C2	1	10	100	渭F	Recommended values for charge pump capacitors
	C3, C4	0.1	1	10	渭F	Recommended values for bypass capacitors
Driver Output Voltage	Vout(Tx)	-7	-10	-12	V	Output voltage swing for RS-232 compliance
Receiver Input Voltage	Vin(Rx)	-12		12	V	Input voltage range for RS-232 compliance
Power Consumption	Ptot		20		mW	Total power consumption at 5V supply

Instructions for Using the MAX232N:

1. Power Supply:

   • Connect the VCC pin to a 5V supply.
   • Connect the GND pin to ground.

2. Capacitors:

   • Connect 10渭F capacitors (C1 and C2) between the V+ and V- pins to the respective charge pump capacitors.
   • Connect 1渭F capacitors (C3 and C4) between VCC and GND for bypassing.

3. RS-232 Interface:

   • Connect the T1OUT and T2OUT pins to the RS-232 transmit lines.
   • Connect the R1IN and R2IN pins to the RS-232 receive lines.
   • Connect the R1OUT and R2OUT pins to the TTL/CMOS receive lines.
   • Connect the T1IN and T2IN pins to the TTL/CMOS transmit lines.

4. Data Transmission:

   • Ensure that the data rate does not exceed 20 kbps for reliable operation.
   • The drivers (T1IN, T2IN) should provide a logic level signal (0V for low, VCC for high).
   • The receivers (R1OUT, R2OUT) will provide a logic level signal based on the RS-232 input.

5. Temperature Considerations:

   • Operate the device within the -40掳C to 85掳C temperature range to ensure reliable performance.

6. Layout Considerations:

   • Place the capacitors as close as possible to the IC to minimize parasitic inductance and improve performance.
   • Use a ground plane to reduce noise and improve signal integrity.

7. ESD Protection:

   • Handle the IC with care to avoid electrostatic discharge (ESD) damage.
   • Use proper ESD protection devices and practices when handling and soldering the IC.

(For reference only)