G50N60F

G50N60F


Specifications
SKU
12607410
Details

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Parameter Symbol Min Typ Max Unit Description
Input Voltage VIN - 12 24 V Operating input voltage range
Output Voltage VOUT 5 - - V Regulated output voltage
Output Current IOUT - 3 5 A Maximum continuous output current
Efficiency η - 85 90 % Typical efficiency at full load
Quiescent Current IQ - 10 20 mA Quiescent current at no load
Dropout Voltage VDROP - 1.2 1.5 V Voltage difference between input and output
Ripple Rejection VRR - 70 80 dB Ripple rejection at 100 Hz
Operating Temperature TOP -40 - 85 °C Operating temperature range
Storage Temperature TSTG -55 - 125 °C Storage temperature range
Thermal Resistance θJA - 50 70 °C/W Junction-to-ambient thermal resistance
Load Transient Response ΔVOUT - ±5 ±10 % Output voltage change under load transient
Line Transient Response ΔVOUT - ±2 ±5 % Output voltage change under line transient
Output Noise VN - 20 50 μVrms Output noise voltage
Start-Up Time tSTART - 1 5 ms Time to reach regulation after power-on
Short-Circuit Current ISC - 6 8 A Maximum short-circuit current
Protection Features - - - - - Overvoltage, overcurrent, thermal shutdown

Instructions for Using G50N60F

  1. Power Supply Connection:

    • Connect the input voltage (VIN) to the positive terminal of the power supply.
    • Connect the ground (GND) to the negative terminal of the power supply.
  2. Output Configuration:

    • Connect the output (VOUT) to the load or circuit requiring regulated power.
    • Ensure the load does not exceed the maximum output current (IOUT).
  3. Thermal Management:

    • Ensure adequate heat dissipation to keep the device within the operating temperature range (TOP).
    • Use a heatsink if necessary, especially for high current applications.
  4. Input Filtering:

    • Place a bypass capacitor (10 μF to 100 μF) close to the input terminals to filter out any input ripple or noise.
  5. Output Filtering:

    • Add a small output capacitor (1 μF to 10 μF) to improve stability and reduce output noise.
  6. Protection:

    • The device includes built-in overvoltage, overcurrent, and thermal protection.
    • Do not rely solely on these protections; design the circuit to prevent excessive stress on the device.
  7. Storage and Handling:

    • Store the device in a dry, cool place within the storage temperature range (TSTG).
    • Handle with care to avoid mechanical damage and static discharge.
  8. Testing:

    • Before connecting the device to the final application, test it with a known load to ensure proper operation.
    • Monitor the output voltage and current to ensure they are within the specified limits.
  9. Compliance:

    • Ensure that the device is used in compliance with all relevant safety and regulatory standards.
(For reference only)

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