Details

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BUY 200N25N https://www.utsource.net/itm/p/12607418.html

Parameter	Symbol	Min	Typ	Max	Unit
Breakdown Voltage	BVdss	-	25	-	V
Continuous Drain Current	Id	-	200	-	mA
Gate-Source Voltage	Vgs	-10	-	10	V
Total Power Dissipation	Ptot	-	2.5	-	W
Junction Temperature	Tj	-55	-	150	掳C
Storage Temperature	Tstg	-65	-	150	掳C

Instructions for Use:

1. Handling:

   • Avoid excessive mechanical stress on the leads.
   • Use proper ESD (Electrostatic Discharge) protection when handling the device.

2. Mounting:

   • Ensure good thermal contact with the heat sink if necessary.
   • Soldering temperature should not exceed 260掳C for more than 10 seconds.

3. Operation:

   • Do not exceed the maximum ratings listed in the table.
   • Ensure that the gate-source voltage (Vgs) is within the specified range to avoid damage.
   • Monitor the junction temperature (Tj) to prevent overheating.

4. Testing:

   • Use appropriate test equipment to measure parameters such as breakdown voltage and continuous drain current.
   • Follow safety guidelines to prevent electrical shock or damage to the device.

5. Storage:

   • Store in a dry, cool place away from direct sunlight.
   • Keep the device in its original packaging until ready for use to protect against moisture and static electricity.

(For reference only)