Details
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| Parameter | Symbol | Min | Typical | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 2.0 | - | 5.5 | V | - |
| Input Low Voltage | VIL | - | 0.8 | - | V | VCC = 5V |
| Input High Voltage | VIH | - | 2.0 | - | V | VCC = 5V |
| Output Low Voltage | VOL | - | 0.4 | 0.5 | V | IOL = 16mA |
| Output High Voltage | VOH | 4.5 | 4.9 | - | V | IOH = -4mA, VCC = 5V |
| Propagation Delay Time | tpd | - | 10 | 18 | ns | VCC = 5V, TA = 25掳C |
| Power Dissipation | Pd | - | - | 100 | mW | Per Package |
| Operating Temperature | TA | -40 | - | 85 | 掳C | - |
| Storage Temperature | TSTG | -65 | - | 150 | 掳C | - |
Instructions for Use:
Power Supply:
- Connect the VCC pin to a power supply between 2.0V and 5.5V.
- Ground the GND pin.
Input Signals:
- Ensure input signals are within the specified range (VIL and VIH) for reliable operation.
- Avoid floating inputs; use pull-up or pull-down resistors as needed.
Output Loads:
- Do not exceed the maximum output current ratings (IOL and IOH).
- Ensure the load is within the output voltage specifications (VOL and VOH).
Propagation Delay:
- Account for the propagation delay time (tpd) when designing timing-sensitive circuits.
Temperature Considerations:
- Operate the device within the specified temperature range (TA) for optimal performance.
- Store the device within the storage temperature range (TSTG) to prevent damage.
Handling:
- Handle the device with care to avoid static damage.
- Follow ESD (Electrostatic Discharge) precautions during handling and assembly.
Mounting:
- Ensure proper soldering techniques to avoid thermal stress on the device.
- Use appropriate PCB layout and grounding techniques to minimize noise and interference.
Testing:
- Test the device under typical operating conditions to ensure it meets the specified parameters.
- Use a multimeter or oscilloscope to verify voltage levels and signal integrity.
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