Details

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BUY 74HC646AP https://www.utsource.net/itm/p/12607445.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	2.0	-	6.0	V
Input Low Voltage	VIL	-	-	1.5	V	VCC = 4.5 to 5.5V
Input High Voltage	VIH	3.5	-	-	V	VCC = 4.5 to 5.5V
Output Low Voltage (Sink)	VOL	0.0	0.1	0.2	V	IOL = 4 mA
Output High Voltage (Source)	VOH	4.8	4.9	5.0	V	IOH = -4 mA, VCC = 5V
Input Leakage Current	IIL	-1	-	1	渭A	VCC = 4.5 to 5.5V
Output Leakage Current	IOL	-1	-	1	渭A	VCC = 4.5 to 5.5V
Propagation Delay Time	tpd	-	10	30	ns	VCC = 4.5 to 5.5V, TA = 25掳C
Power Dissipation	PD	-	-	100	mW	Per Package
Operating Temperature Range	TA	-40	-	85	掳C
Storage Temperature Range	TSTG	-65	-	150	掳C

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage (V_CC) is within the range of 2.0V to 6.0V. The typical operating voltage is 5V.

2. Input Levels:

   • For proper operation, input low voltage (V_IL) should be less than or equal to 1.5V, and input high voltage (V_IH) should be greater than or equal to 3.5V when V_CC is between 4.5V and 5.5V.

3. Output Levels:

   • When sinking current (I_OL = 4 mA), the output low voltage (V_OL) should be between 0.0V and 0.2V.
   • When sourcing current (I_OH = -4 mA), the output high voltage (V_OH) should be between 4.8V and 5.0V at V_CC = 5V.

4. Leakage Current:

   • Input leakage current (I_IL) and output leakage current (I_OL) should not exceed 卤1 渭A.

5. Propagation Delay:

   • The propagation delay time (t_pd) is typically 10 ns with a maximum of 30 ns at room temperature (25掳C).

6. Power Dissipation:

   • The maximum power dissipation per package is 100 mW.

7. Temperature Ranges:

   • The operating temperature range (T_A) is from -40掳C to 85掳C.
   • The storage temperature range (T_STG) is from -65掳C to 150掳C.

8. Handling:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD). Use proper ESD protection measures.

9. Mounting:

   • Ensure proper mounting and soldering techniques to avoid thermal and mechanical stress on the device.

10. Testing:

    • Before final assembly, test the device under the specified conditions to ensure it meets the required performance parameters.

(For reference only)