Details

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BUY BU26156 https://www.utsource.net/itm/p/12607501.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Input Voltage	VIN	4.5	-	36	V	Operating input voltage range
Output Voltage	VOUT	-	-	-	V	Adjustable output voltage
Output Current	IOUT	-	1.5	3	A	Continuous output current
Switching Frequency	fSW	200	600	800	kHz	Switching frequency range
Efficiency	畏	-	92	-	%	Typical efficiency at nominal conditions
Quiescent Current	IQ	-	70	-	渭A	Quiescent current
Shutdown Current	ISD	-	1	-	渭A	Shutdown current
Thermal Shutdown	TSD	-	160	-	掳C	Thermal shutdown temperature
Operating Temperature	TOPR	-40	-	125	掳C	Operating ambient temperature range
Storage Temperature	TSTG	-40	-	150	掳C	Storage temperature range

Instructions for Using BU26156

1. Input Voltage (VIN):

   • Ensure the input voltage is within the specified range (4.5V to 36V) to avoid damage to the device.
   • Use appropriate filtering and decoupling capacitors to stabilize the input voltage.

2. Output Voltage (VOUT):

   • The output voltage can be adjusted using external resistors. Refer to the datasheet for specific resistor values.
   • Ensure the output voltage is within the desired range for your application.

3. Output Current (IOUT):

   • The device can provide a continuous output current up to 3A. For higher currents, consider heatsinking or additional cooling.
   • Monitor the output current to prevent overloading the device.

4. Switching Frequency (fSW):

   • The switching frequency can be set between 200kHz and 800kHz. Higher frequencies reduce the size of external components but increase switching losses.
   • Choose the frequency based on your application requirements and component availability.

5. Efficiency (畏):

   • The typical efficiency is 92% under nominal conditions. Optimize the design to achieve the best efficiency.
   • Use low ESR capacitors and low resistance inductors to minimize losses.

6. Quiescent Current (IQ):

   • The quiescent current is typically 70渭A. This is important for low-power applications where standby power consumption must be minimized.

7. Shutdown Current (ISD):

   • The shutdown current is typically 1渭A. Use the shutdown pin to turn off the device when not in use to save power.

8. Thermal Shutdown (TSD):

   • The device will shut down if the junction temperature exceeds 160掳C. Ensure proper thermal management to prevent overheating.

9. Operating Temperature (TOPR):

   • The device can operate in ambient temperatures ranging from -40掳C to 125掳C. Ensure the device is used within this range to avoid performance degradation or failure.

10. Storage Temperature (TSTG):

    • Store the device in temperatures ranging from -40掳C to 150掳C to ensure long-term reliability.

Additional Notes:

• Always refer to the latest datasheet for detailed information and specific application notes.
• Proper PCB layout and component selection are crucial for optimal performance and reliability.

(For reference only)