Details

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BUY BUK465-60A https://www.utsource.net/itm/p/12607544.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Collector-Emitter Voltage	VCE	-	-	600	V
Emitter-Collector Voltage	VEC	-	-	600	V
Gate-Emitter Voltage	VGE	-18	-	20	V
Continuous Collector Current	IC	-	-	30	A	TC = 25掳C
Continuous Collector Current	IC	-	-	20	A	TC = 100掳C
Pulse Collector Current	ICM	-	-	45	A	tp = 10 ms, IG = 5 A
Power Dissipation	PT	-	-	240	W	TC = 25掳C
Power Dissipation	PT	-	-	180	W	TC = 100掳C
Junction Temperature	TJ	-	-	175	掳C
Storage Temperature	TSTG	-55	-	150	掳C

Instructions for Use:

1. Mounting and Handling:

   • Ensure that the device is handled with care to avoid mechanical damage.
   • Use appropriate heat sinks to manage thermal dissipation, especially during high-power operations.

2. Electrical Connections:

   • Connect the collector (C) and emitter (E) terminals correctly to avoid reverse voltage conditions.
   • Apply the gate (G) signal carefully to prevent overvoltage or excessive current through the gate.

3. Thermal Management:

   • Monitor the junction temperature (T_J) to ensure it does not exceed 175掳C.
   • Use thermal paste between the device and the heat sink to improve thermal conductivity.

4. Operating Conditions:

   • Do not exceed the maximum ratings specified in the table.
   • For continuous operation, ensure that the ambient temperature and power dissipation are within safe limits.

5. Pulse Operation:

   • When using the device in pulse mode, ensure that the pulse duration and frequency do not cause the device to exceed its thermal limits.
   • Verify that the peak current (I_CM) does not exceed 45 A for pulses of 10 ms duration.

6. Storage:

   • Store the device in a dry, cool environment to prevent moisture damage.
   • Avoid exposing the device to temperatures outside the storage range (-55掳C to 150掳C).

7. Testing:

   • Before installing the device in a circuit, test it under controlled conditions to ensure it meets the specified parameters.
   • Use appropriate test equipment to avoid damaging the device during testing.

(For reference only)