Details
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| Parameter | Description | Value | Unit |
|---|---|---|---|
| Device Type | High-Side Switch | ||
| Package | DFN-8 (3x3) | ||
| Input Voltage Range | VIN | 4.5 to 60 | V |
| Output Current | IOUT | 2.5 | A |
| Quiescent Current | IQ | 20 | 渭A |
| Shutdown Current | ISD | 0.1 | 渭A |
| Control Input Voltage | VCTRL | 1.2 to 60 | V |
| Logic Input Voltage | VINL | 1.8 to 5.5 | V |
| Logic Input Current | IINL | 10 | 渭A |
| Thermal Shutdown Temperature | TSD | 150 | 掳C |
| Operating Temperature Range | TA | -40 to 125 | 掳C |
| Storage Temperature Range | TSTOR | -65 to 150 | 掳C |
| Junction-to-Ambient Thermal Resistance | R胃JA | 45 | 掳C/W |
Instructions for Use:
Power Supply Connection:
- Connect the input voltage (VIN) to the power supply.
- Ensure the input voltage is within the specified range (4.5V to 60V).
Load Connection:
- Connect the load between the output (OUT) pin and ground (GND).
- The maximum continuous output current should not exceed 2.5A.
Control Input:
- Apply the control voltage (VCTRL) to enable or disable the high-side switch.
- The control voltage should be within the range of 1.2V to 60V.
- For logic-level control, use the logic input (INL) with a voltage range of 1.8V to 5.5V.
Ground Connection:
- Ensure a solid ground connection to both the power supply and the load.
Thermal Management:
- Monitor the operating temperature to ensure it stays within the specified range (-40掳C to 125掳C).
- If the junction temperature exceeds 150掳C, the device will automatically shut down to prevent damage.
Storage:
- Store the device in a dry environment with temperatures between -65掳C and 150掳C.
Handling:
- Handle the device with care to avoid static discharge and physical damage.
- Follow standard ESD precautions when handling the device.
Mounting:
- Solder the device according to the recommended soldering profile for the DFN-8 package.
- Ensure proper thermal management by providing adequate copper area for heat dissipation.
Testing:
- Test the device under controlled conditions to verify its operation before deploying it in a final application.
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