Details

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Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage (High Side)	VBH	10	-	20	V	-
Supply Voltage (Low Side)	VBL	7.5	-	20	V	-
Input High Level Voltage	VIH	2.0	-	20	V	-
Input Low Level Voltage	VIL	-	-	0.8	V	-
Output High Level Voltage	VOH	-	13.5	16.5	V	VBH = 15V, IOL = -1mA
Output Low Level Voltage	VOL	0.4	-	1.0	V	VBL = 15V, IOL = 1mA
Input Capacitance	CISS	-	900	-	pF	f = 1MHz
Gate Drive Current (Source)	IGH	-	2A	-	A	-
Gate Drive Current (Sink)	I<sub.GL	-	2A	-	A	-
Propagation Delay Time	td	-	50	-	ns	VDD = 15V, VGS = 10V, RL = 100惟
Dead Time	tDT	80	-	120	ns	VDD = 15V
Operating Temperature Range	TA	-40	-	125	掳C	-

Instructions for Use:

1. Power Supply Connections:

   • Connect the high-side supply voltage (V_BH) to the appropriate pin.
   • Connect the low-side supply voltage (V_BL) to the appropriate pin.
   • Ensure that the supply voltages are within the specified range to avoid damage.

2. Input Signals:

   • Apply input signals with high-level voltages (V_IH) and low-level voltages (V_IL) as specified.
   • Ensure that the input signals are compatible with the input capacitance (C_ISS).

3. Output Configuration:

   • Connect the load to the output pins, ensuring that the output high-level voltage (V_OH) and output low-level voltage (V_OL) are within the specified limits.
   • Use appropriate gate resistors (R_L) to match the gate drive current requirements (I_GH and I_GL).

4. Timing Considerations:

   • Account for the propagation delay time (t_d) and dead time (t_DT) in your circuit design to prevent shoot-through conditions.
   • Use the typical values for these parameters as a guide for timing calculations.

5. Temperature Management:

   • Operate the device within the specified temperature range (T_A) to ensure reliable performance.
   • Consider heat sinking or other cooling methods if operating at high temperatures.

6. Safety and Handling:

   • Handle the device with care to avoid electrostatic discharge (ESD) damage.
   • Follow proper soldering techniques to prevent thermal stress during assembly.

7. Testing and Troubleshooting:

   • Verify all connections and power supply levels before applying power.
   • Use a multimeter or oscilloscope to monitor voltages and signals during testing.
   • Refer to the datasheet for more detailed troubleshooting tips and application notes.

(For reference only)