Details

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BUY M5M44256BP-10 https://www.utsource.net/itm/p/12607673.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VCC	1.7	1.8	1.98	V	Operating supply voltage
Standby Current	Icc(SB)	-	20	-	渭A	Current consumption in standby mode
Active Current	Icc(ACT)	-	30	-	mA	Current consumption in active mode
Access Time	tAC	-	70	-	ns	Access time from chip enable to valid output
Page Size	PS	-	256	-	Bytes	Size of a page for read/write operations
Write Cycle Time	tWC	-	50	-	渭s	Time required to complete a write cycle
Data Retention Time	tRET	-	10	-	years	Guaranteed data retention time
Operating Temperature	Toper	-40	-	85	掳C	Temperature range for operation
Storage Temperature	Tstg	-55	-	125	掳C	Temperature range for storage
Package Type	PKG	-	-	-	-	BGA (Ball Grid Array)
Number of Pins	Pins	-	48	-	-	Number of pins in the package
Memory Capacity	CAP	-	32	-	Mb	Total memory capacity
Organization	ORG	-	-	-	-	16M x 2 bits

Instructions:

1. Power Supply:

   • Ensure the supply voltage is within the specified range (1.7V to 1.98V) to avoid damage to the device.

2. Current Consumption:

   • In standby mode, the current consumption should not exceed 20 渭A.
   • In active mode, the current consumption should not exceed 30 mA.

3. Timing Parameters:

   • The access time (tAC) is typically 70 ns, ensuring that the output is valid after this time when the chip enable signal is activated.
   • The write cycle time (tWC) is typically 50 渭s, which is the time required to complete a write operation.

4. Data Operations:

   • The device supports page read and write operations with a page size of 256 bytes.
   • Data retention is guaranteed for up to 10 years under normal operating conditions.

5. Temperature Ranges:

   • The operating temperature range is -40掳C to 85掳C.
   • The storage temperature range is -55掳C to 125掳C.

6. Package and Pin Configuration:

   • The device is packaged in a 48-pin BGA (Ball Grid Array).
   • Refer to the datasheet for the detailed pin configuration and functions.

7. Handling:

   • Handle the device with care to avoid static discharge and physical damage.
   • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.

8. Storage:

   • Store the device in a dry, cool place within the specified storage temperature range to ensure long-term reliability.

(For reference only)