Details
BUY 2SD836 https://www.utsource.net/itm/p/12607718.html
| Parameter | Symbol | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Collector-Emitter Voltage | VCE | - | - | 400 | V | - |
| Emitter-Base Voltage | VEB | -6 | - | 6 | V | - |
| Collector Current | IC | - | 15 | - | A | - |
| Base Current | IB | - | 3 | - | A | - |
| Power Dissipation | PT | - | - | 125 | W | - |
| Junction Temperature | TJ | -55 | - | 150 | 掳C | - |
| Storage Temperature | TSTG | -65 | - | 150 | 掳C | - |
| Thermal Resistance | RthJC | - | 1.5 | - | K/W | - |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to maintain junction temperature within specified limits.
- Use appropriate mounting hardware to secure the device.
Biasing:
- Apply base current (IB) to control the collector current (IC).
- Ensure that the base-emitter voltage (VEB) does not exceed the maximum ratings.
Operating Conditions:
- Do not exceed the maximum collector-emitter voltage (VCE) or power dissipation (PT).
- Monitor the junction temperature (TJ) to avoid overheating.
Storage:
- Store the device in a dry, cool place within the storage temperature range (TSTG).
Handling:
- Handle with care to avoid mechanical damage.
- Use anti-static precautions to prevent damage from electrostatic discharge (ESD).
Testing:
- Use appropriate test equipment and methods to ensure accurate measurements.
- Refer to the datasheet for specific test conditions and procedures.
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