Details
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| Parameter | Value | Unit |
|---|---|---|
| Part Number | D4168C-15 | |
| Type | Dual 4-Channel Multiplexer/Demultiplexer | |
| Logic Family | CMOS | |
| Supply Voltage (Vdd) | 2.0 to 5.5 | V |
| Operating Temperature | -40 to 85 | 掳C |
| Storage Temperature | -65 to 150 | 掳C |
| Input Voltage (VIH) | 70% Vdd | V |
| Input Voltage (VIL) | 30% Vdd | V |
| Output Voltage (VOH) | Vdd - 0.1 | V |
| Output Voltage (VOL) | 0.1 | V |
| Propagation Delay Time | 10 | ns |
| Power Dissipation | 100 | mW |
| Pin Count | 16 | |
| Package Type | TSSOP |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage (Vdd) is within the range of 2.0V to 5.5V.
- Connect Vdd to the positive power supply and GND to the ground.
Input Signals:
- Apply input signals (VIH, VIL) within the specified voltage levels relative to Vdd.
- Ensure that the input signals are not left floating; use pull-up or pull-down resistors if necessary.
Output Signals:
- The output signals (VOH, VOL) will be driven to the specified voltage levels.
- Ensure that the load connected to the outputs does not exceed the maximum current ratings.
Control Signals:
- Use the control signals (S0, S1, S2, S3) to select the appropriate channel.
- The control signals should be within the same voltage range as the supply voltage.
Temperature Considerations:
- Operate the device within the specified operating temperature range (-40掳C to 85掳C).
- Store the device within the storage temperature range (-65掳C to 150掳C).
Propagation Delay:
- Account for the propagation delay time of 10ns when designing timing-sensitive circuits.
Power Dissipation:
- Ensure that the total power dissipation does not exceed 100mW to avoid overheating.
Package Handling:
- Handle the TSSOP package with care to avoid damage to the pins and the device.
- Follow standard ESD (Electrostatic Discharge) precautions when handling the device.
Testing:
- Before integrating the device into a larger circuit, test it individually to ensure proper functionality.
Layout Considerations:
- Place decoupling capacitors close to the Vdd and GND pins to minimize noise and improve stability.
- Ensure proper PCB layout to minimize signal interference and crosstalk.
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