IRG8P25N120KD

IRG8P25N120KD


Specifications
Details

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Parameter Symbol Value Unit Conditions/Notes
Maximum Drain Voltage VDSS 1200 V Max. drain-to-source voltage
Maximum Gate-Source Voltage VGS 卤20 V Max. gate-to-source voltage
Maximum Drain Current (Pulsed) ID 38 A Pulse condition, Tc = 25掳C
Maximum Drain Current (Continuous) ID 8 A Continuous condition, Tc = 25掳C
Total Power Dissipation PD 140 W Case temperature = 25掳C
Junction Temperature TJ -55 to 175 掳C Operating junction temperature range
Storage Temperature TSTG -55 to 150 掳C Storage and handling temperature range
Gate Charge Qg 196 nC At VDS = 500V, ID = 12A
Input Capacitance Ciss 4460 pF At VDS = 30V, f = 1MHz
Output Capacitance Coff 1020 pF At VDS = 30V, f = 1MHz
Reverse Transfer Capacitance Crss 870 pF At VDS = 30V, f = 1MHz

Instructions for Use:

  1. Handling Precautions: The IRG8P25N120KD is sensitive to electrostatic discharge (ESD). Handle with appropriate ESD protection measures.
  2. Mounting: Ensure proper heat sinking to manage the power dissipation within limits. The device can dissipate up to 140W at a case temperature of 25掳C.
  3. Voltage Limits: Do not exceed the maximum drain-source voltage (VDSS) of 1200V or the gate-source voltage (VGS) of 卤20V to prevent damage.
  4. Current Ratings: Observe the pulsed and continuous drain current ratings (ID) to avoid overheating or failure. Pulsed current should not exceed 38A, and continuous current should not exceed 8A at a case temperature of 25掳C.
  5. Operating Temperature: Keep the junction temperature between -55掳C and 175掳C for reliable operation.
  6. Storage Conditions: Store in a controlled environment where temperatures range from -55掳C to 150掳C.
  7. Capacitance Considerations: Be aware of the input (Ciss), output (Coff), and reverse transfer capacitances (Crss) for circuit design considerations, especially in high-frequency applications.

Ensure all specifications are met for optimal performance and reliability.

(For reference only)

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