IRLML2502PBF

IRLML2502PBF


Specifications
Details

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Parameter Symbol Min Typ Max Unit Conditions
Drain-Source On Resistance RDS(on) - 0.12 - VGS = 4.5V, ID = 1A
Gate Threshold Voltage VGS(th) 0.8 - 2.0 V ID = 250渭A
Continuous Drain Current ID - - 2.6 A TC = 25掳C
Pulse Drain Current ID(p) - - 7.2 A TC = 25掳C, t = 100渭s
Power Dissipation PD - - 0.35 W TC = 25掳C
Junction Temperature TJ - - 150 掳C -

Instructions for Use:

  1. Handling Precautions: The IRLML2502PBF is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and installation.

  2. Mounting: Ensure that the device is mounted on a suitable heat sink if operating at high currents or power levels to maintain junction temperature within limits.

  3. Operating Conditions: Verify that the operating conditions do not exceed the maximum ratings provided in the table. Pay special attention to the drain-source voltage, gate-source voltage, and junction temperature.

  4. Gate Drive Requirements: For optimal performance, ensure that the gate drive voltage is sufficient to fully turn on the MOSFET, typically around 4.5V to minimize RDS(on).

  5. Storage: Store in a dry environment and observe the moisture sensitivity level (MSL) guidelines before soldering to prevent damage from moisture-related stresses.

  6. Testing: After assembly, test the device under typical operating conditions to ensure it meets the required specifications.

  7. Compliance: Ensure compliance with all relevant safety standards and regulations when using this component in your application.

(For reference only)

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