IRF541

IRF541


Specifications
SKU
12607767
Details

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Parameter Symbol Min Typ Max Unit Conditions
Drain-Source Voltage VDS - - 100 V -
Gate-Source Voltage VGS -20 - 20 V -
Continuous Drain Current ID - 28 - A TC = 25掳C
Pulse Drain Current ID(peak) - 77 - A tp = 10 ms, TC = 25掳C
Power Dissipation Ptot - - 130 W TC = 25掳C
Junction Temperature TJ - - 150 掳C -
Storage Temperature Tstg -55 - 150 掳C -
Gate Charge QG - 68 - nC -
Input Capacitance Ciss - 1600 - pF VDS = 25V, f = 1 MHz
Output Capacitance Coss - 390 - pF VDS = 25V, f = 1 MHz
Reverse Transfer Capacitance Crss - 290 - pF VDS = 25V, f = 1 MHz
Threshold Voltage VGS(th) 2 4 6 V ID = 250 渭A
On-State Resistance RDS(on) - 0.044 - VGS = 10V, ID = 10A

Instructions for Use:

  1. Heat Dissipation: Ensure adequate heat dissipation to keep the junction temperature below 150掳C. Use a heatsink if necessary.
  2. Gate Drive: Apply a gate voltage (VGS) between 10V and 20V for optimal performance. Avoid voltages outside the -20V to +20V range to prevent damage.
  3. Current Limiting: Do not exceed the maximum continuous drain current (ID) of 28A or the pulse drain current (ID(peak)) of 77A for 10 ms pulses.
  4. Storage Conditions: Store the device in a dry environment within the temperature range of -55掳C to 150掳C.
  5. Capacitance Considerations: Be aware of the input, output, and reverse transfer capacitances when designing circuits to avoid instability or oscillation.
  6. Threshold Voltage: The threshold voltage (VGS(th)) can vary between 2V and 6V. Ensure that the gate drive voltage is sufficient to fully turn on the MOSFET.
  7. On-State Resistance: The on-state resistance (RDS(on)) is typically 0.044惟 at VGS = 10V and ID = 10A. This value can affect power dissipation and efficiency.

For more detailed information, refer to the datasheet provided by the manufacturer.

(For reference only)

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