Details

---

BUY BU426A https://www.utsource.net/itm/p/12607782.html

Parameter	Symbol	Min	Typ	Max	Unit
Supply Voltage	Vcc	4.5	5	5.5	V
Output Current	Iout	-	100	200	mA
Operating Temperature	Topr	-40	-	85	掳C
Storage Temperature	Tstg	-65	-	150	掳C
Input Capacitance	Cin	-	10	-	pF
Output Capacitance	Cout	-	100	-	pF
Rise Time	tr	-	5	-	ns
Fall Time	tf	-	5	-	ns
Propagation Delay Time	tpd	-	5	-	ns

Instructions for Using BU426A

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the range of 4.5V to 5.5V. The typical operating voltage is 5V.

2. Output Current (Iout):

   • The output current should not exceed 200mA. For optimal performance, keep it around 100mA.

3. Operating Temperature (Topr):

   • The device can operate within a temperature range of -40掳C to 85掳C. Avoid exceeding these limits to prevent damage.

4. Storage Temperature (Tstg):

   • When storing the device, ensure temperatures are between -65掳C and 150掳C to maintain its integrity.

5. Input Capacitance (Cin):

   • The input capacitance is typically 10pF. This value should be considered when designing the circuit to avoid loading issues.

6. Output Capacitance (Cout):

   • The output capacitance is typically 100pF. This should be factored into the design to ensure stable operation.

7. Rise Time (tr) and Fall Time (tf):

   • Both rise time and fall time are typically 5ns. These values help in determining the speed at which the device can switch states.

8. Propagation Delay Time (tpd):

   • The propagation delay time is typically 5ns. This is the time it takes for a change at the input to appear at the output.

9. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Use appropriate ESD protection measures during handling and installation.

10. Mounting:

    • Ensure proper mounting on the PCB to avoid mechanical stress on the device.
    • Follow the recommended footprint and soldering guidelines provided by the manufacturer.

11. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure it meets the specified parameters.

12. Documentation:

    • Refer to the datasheet and application notes for detailed information and specific use cases.

(For reference only)