TCDT1124

TCDT1124


Specifications
SKU
12607795
Details

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Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD 2.7 - 5.5 V Operating supply voltage range
Supply Current IDD - 300 - 渭A Quiescent current at VDD = 5V, TA = 25掳C
Input Voltage Range VIN 0 - VDD V Valid input voltage range for digital inputs
Output Voltage (High) VOH - VDD-0.4 VDD-0.1 V Output high voltage at IOH = 1mA, VDD = 5V, TA = 25掳C
Output Voltage (Low) VOL 0.1 0.4 - V Output low voltage at IOL = 1mA, VDD = 5V, TA = 25掳C
Propagation Delay Time tpd 10 15 20 ns Propagation delay time from input to output at VDD = 5V, TA = 25掳C
Operating Temperature TA -40 - 85 掳C Ambient operating temperature range
Storage Temperature TSTG -65 - 150 掳C Storage temperature range

Instructions for TCDT1124

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the range of 2.7V to 5.5V.
    • The quiescent current (IDD) should not exceed 300渭A at VDD = 5V and TA = 25掳C.
  2. Input Signals:

    • Digital input voltages (VIN) must be within the range of 0V to VDD.
    • Ensure that the input signals are clean and stable to avoid erroneous operation.
  3. Output Signals:

    • The output high voltage (VOH) will be at least VDD - 0.4V and can reach up to VDD - 0.1V when sourcing 1mA.
    • The output low voltage (VOL) will be between 0.1V and 0.4V when sinking 1mA.
  4. Timing:

    • The propagation delay time (tpd) from input to output is typically 15ns, with a minimum of 10ns and a maximum of 20ns at VDD = 5V and TA = 25掳C.
  5. Temperature Considerations:

    • The device is designed to operate in ambient temperatures ranging from -40掳C to 85掳C.
    • Store the device in temperatures ranging from -65掳C to 150掳C.
  6. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Use proper ESD protection equipment when handling the device.
  7. Mounting:

    • Follow the recommended soldering profile to ensure reliable mounting on the PCB.
    • Avoid excessive thermal stress during soldering.
  8. Testing:

    • Perform initial testing at room temperature (25掳C) to verify functionality.
    • Conduct additional tests at the extreme ends of the operating temperature range to ensure robust performance.
  9. Troubleshooting:

    • If the device does not function as expected, check the power supply, input signals, and connections.
    • Verify that the device is not operating outside its specified temperature range.

For detailed specifications and additional information, refer to the datasheet provided by the manufacturer.

(For reference only)

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