Details

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BUY LT1070 https://www.utsource.net/itm/p/12607799.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Input Voltage	VIN	Operating Range	2.5	-	40	V
Output Voltage	VOUT	Adjustable	1.23	-	38.5	V
Quiescent Current	IQ	No Load	-	60	120	μA
Shutdown Current	ISD	Shutdown Mode	-	0.1	1	μA
Dropout Voltage	VDROPOUT	IOUT = 100 mA, VIN = 5V	-	1.2	1.5	V
Output Current	IOUT	Continuous	-	150	-	mA
Transient Response	ΔVOUT	100 mA Load Step	-	100	200	mV
Ripple Rejection	RR	10 Hz to 100 kHz	60	70	80	dB
Thermal Shutdown	TSD	Activation Temperature	-	165	-	°C
Overcurrent Protection	OCP	Activation Current	-	250	-	mA

Instructions for Use:

1. Power Supply:

   • Ensure the input voltage (VIN) is within the operating range of 2.5V to 40V.
   • Use appropriate decoupling capacitors (typically 0.1μF and 10μF) close to the input and output pins to stabilize the supply.

2. Output Voltage Setting:

   • The output voltage (VOUT) can be adjusted using external resistors (R1 and R2) according to the formula: [ V_ = 1.23 left(1 + fracright) ]
   • Choose resistor values to achieve the desired output voltage.

3. Quiescent Current:

   • The quiescent current (IQ) is typically 60μA with a maximum of 120μA. This should be considered when designing low-power applications.

4. Shutdown Mode:

   • To place the device in shutdown mode, pull the SHDN pin low. The shutdown current (ISD) is typically 0.1μA with a maximum of 1μA.

5. Dropout Voltage:

   • The dropout voltage (VDROPOUT) is the minimum difference between VIN and VOUT required to maintain regulation. It is typically 1.2V at 100mA load.

6. Output Current:

   • The continuous output current (IOUT) is up to 150mA. Ensure the load does not exceed this limit to avoid overheating or damage.

7. Transient Response:

   • The transient response (ΔVOUT) is the change in output voltage during a load step. It is typically 100mV with a maximum of 200mV.

8. Ripple Rejection:

   • The ripple rejection (RR) is the ability to reject input voltage ripple. It is typically 70dB from 10Hz to 100kHz.

9. Thermal Shutdown:

   • The device will shut down if the junction temperature exceeds 165°C to prevent damage.

10. Overcurrent Protection:

    • The overcurrent protection (OCP) activates at approximately 250mA to protect the device from excessive current draw.

Layout Considerations:

• Place the input and output capacitors as close as possible to the respective pins to minimize parasitic inductance.
• Use wide traces for power and ground connections to reduce resistance and improve thermal performance.
• Ensure proper heat sinking if the device is expected to dissipate significant power.

(For reference only)