Details

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BUY TA78L015AP https://www.utsource.net/itm/p/12607805.html

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Input Voltage	VIN	-	2.7	-	6.0	V
Output Voltage	VOUT	-	1.5	1.5	1.5	V
Output Current	IOUT	Continuous	-	150	300	mA
Dropout Voltage	VD	IOUT = 150mA	-	0.4	0.9	V
Quiescent Current	IQ	VIN = 5V, No Load	-	1.0	2.0	mA
Power Dissipation	PD	-	-	-	750	mW
Operating Temperature	TOPR	-	-40	-	85	掳C
Storage Temperature	TSTG	-	-55	-	150	掳C

Instructions for Use:

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 2.7V to 6.0V to avoid damage to the device.

2. Output Voltage (VOUT):

   • The output voltage is fixed at 1.5V. No external components are required to set this voltage.

3. Output Current (IOUT):

   • The device can provide up to 300mA continuously, with a typical output current of 150mA.

4. Dropout Voltage (VD):

   • The dropout voltage is the difference between the input and output voltages when the output is under load. It should be kept below 0.9V at 150mA to ensure stable operation.

5. Quiescent Current (IQ):

   • The quiescent current is the current drawn by the regulator when no load is applied. It typically ranges from 1.0mA to 2.0mA.

6. Power Dissipation (PD):

   • The maximum power dissipation is 750mW. Ensure proper heat sinking if the device is expected to operate near this limit.

7. Operating Temperature (TOPR):

   • The device is designed to operate within a temperature range of -40掳C to 85掳C. Avoid operating outside this range to prevent damage or reduced performance.

8. Storage Temperature (TSTG):

   • The device can be stored in temperatures ranging from -55掳C to 150掳C without degradation.

9. Capacitors:

   • Use appropriate input and output capacitors to stabilize the voltage and reduce noise. Typically, a 1渭F ceramic capacitor is recommended for both input and output.

10. PCB Layout:

    • Place the input and output capacitors as close as possible to the device to minimize parasitic inductance and improve stability.

11. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuitry. Use ESD protection measures during handling and assembly.

(For reference only)