Details

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BUY NTMFD4C85NT1G https://www.utsource.net/itm/p/12607821.html

Parameter	Description	Value	Unit
Part Number	Component Identifier	NTMFD4C85NT1G	-
Type	Device Type	Multi-Fuse Device	-
Voltage Rating (VRRM)	Maximum Repetitive Peak Reverse Voltage	60	V
Current Rating (IRMS)	Root Mean Square Current	85	A
Package	Encapsulation Type	DPAK	-
Operating Temperature	Range of temperatures in which the device can operate safely	-55 to +125	掳C
Junction Temperature	Maximum allowable temperature at the semiconductor junction	150	掳C
Thermal Resistance	Junction to Ambient Thermal Resistance	40	掳C/W
Power Dissipation	Maximum Power Dissipation	1.25	W

Instructions for Use:

1. Installation:

   • Ensure that the component is installed in a location where it will not be exposed to excessive heat or mechanical stress.
   • Follow standard surface-mount technology (SMT) procedures for mounting the DPAK package.

2. Handling:

   • Handle with care to avoid damage to the leads and body of the component.
   • Use appropriate anti-static precautions during handling.

3. Operating Conditions:

   • Do not exceed the maximum ratings specified in the table.
   • Ensure that the operating temperature range is adhered to for reliable operation.

4. Storage:

   • Store in a dry, cool environment to prevent moisture damage.
   • Follow recommended storage practices to maintain component integrity.

5. Testing:

   • Verify all connections are secure before applying power.
   • Perform initial testing under controlled conditions to ensure proper functionality.

6. Troubleshooting:

   • If issues arise, check connections, power supply, and environmental conditions.
   • Refer to the datasheet for detailed troubleshooting steps.

(For reference only)