Details
BUY 2SC3571-AZ https://www.utsource.net/itm/p/12607867.html
| Parameter | Symbol | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| Collector-Emitter Voltage | VCEO | - | - | 80 | V |
| Collector-Base Voltage | VCBO | - | - | 90 | V |
| Emitter-Base Voltage | VEBO | - | - | 6 | V |
| Collector Current | IC | - | 15 | - | A |
| Base Current | IB | - | 1.5 | - | A |
| DC Current Gain | hFE | 20 | 100 | 400 | - |
| Transition Frequency | fT | - | 150 | - | MHz |
| Power Dissipation | PT | - | - | 125 | W |
| Junction Temperature | TJ | -40 | - | 150 | 掳C |
| Storage Temperature | TSTG | -55 | - | 150 | 掳C |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to manage the power dissipation, especially when operating at high currents.
- Use thermal grease between the transistor and the heatsink to improve thermal conductivity.
Biasing:
- Carefully set the base current (IB) to achieve the desired collector current (IC) while staying within the specified limits of the device.
- Use a suitable biasing network to ensure stable operation over temperature variations.
Operating Conditions:
- Do not exceed the maximum ratings for collector-emitter voltage (VCEO), collector-base voltage (VCBO), and emitter-base voltage (VEBO).
- Ensure that the junction temperature (TJ) does not exceed 150掳C to prevent thermal damage.
Storage:
- Store the device in a dry environment with temperatures between -55掳C and 150掳C to avoid damage from moisture or extreme temperatures.
Handling:
- Handle the device with care to avoid mechanical stress, which can lead to internal damage.
- Use appropriate ESD protection to prevent electrostatic discharge damage.
Testing:
- When testing the device, use a low current initially to verify proper operation before increasing to the rated values.
- Measure the DC current gain (hFE) to ensure it falls within the typical range for the device.
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