Details

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BUY GT30F125 https://www.utsource.net/itm/p/12607868.html

Parameter	Description	Value
Part Number	Full part number	GT30F125
Package Type	Type of package	DIP-8 / SOP-8
Operating Voltage (Vcc)	Supply voltage range	4.5V to 5.5V
Operating Current (Icc)	Supply current at Vcc = 5V	10mA (max)
Output Current (Io)	Maximum output current per pin	20mA (max)
Operating Temperature	Temperature range for operation	-40掳C to +85掳C
Storage Temperature	Temperature range for storage	-65掳C to +150掳C
Input Voltage (VIH)	High-level input voltage	2.0V to 5.5V
Input Voltage (VIL)	Low-level input voltage	0V to 0.8V
Output Voltage (VOH)	High-level output voltage	4.5V to 5.5V (at Io = 0.4mA)
Output Voltage (VOL)	Low-level output voltage	0V to 0.4V (at Io = 4.0mA)
Propagation Delay Time (tPLH)	Propagation delay time from low to high	50ns (max)
Propagation Delay Time (tPHL)	Propagation delay time from high to low	50ns (max)
Power Dissipation	Maximum power dissipation	150mW (max)

Instructions:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
   • The operating current (Icc) should not exceed 10mA.

2. Input Signals:

   • High-level input voltage (VIH) should be between 2.0V and 5.5V.
   • Low-level input voltage (VIL) should be between 0V and 0.8V.

3. Output Signals:

   • High-level output voltage (VOH) should be between 4.5V and 5.5V when the output current (Io) is 0.4mA.
   • Low-level output voltage (VOL) should be between 0V and 0.4V when the output current (Io) is 4.0mA.

4. Propagation Delay:

   • The propagation delay times (tPLH and tPHL) should not exceed 50ns.

5. Temperature Considerations:

   • Operate the device within the temperature range of -40掳C to +85掳C.
   • Store the device within the temperature range of -65掳C to +150掳C.

6. Power Dissipation:

   • Ensure the power dissipation does not exceed 150mW.

7. Handling:

   • Handle the device with care to avoid damage from static electricity.
   • Follow proper soldering techniques to prevent thermal shock.

8. Package Handling:

   • Use appropriate tools and techniques for handling and mounting the DIP-8 or SOP-8 package.
   • Ensure proper alignment during installation to avoid mechanical stress on the pins.

(For reference only)