BUK215-50Y

BUK215-50Y


Specifications
SKU
12607957
Details

BUY BUK215-50Y https://www.utsource.net/itm/p/12607957.html

Parameter Symbol Min Typ Max Unit
Collector-Emitter Voltage VCE - - 500 V
Emitter-Collector Voltage VEC - - 500 V
Collector Current IC - - 5 A
Continuous Collector Current (TC=25掳C) IC(TC) - - 5 A
Continuous Collector Current (TC=100掳C) IC(TC) - - 3.5 A
Power Dissipation (TC=25掳C) PTOT(TC) - - 100 W
Power Dissipation (TC=100掳C) PTOT(TC) - - 65 W
Junction Temperature TJ - - 150 掳C
Storage Temperature TSTG -40 - 150 掳C
Thermal Resistance, Junction to Case RthJC - - 1.2 K/W
Transition Frequency fT - 1.5 - MHz
Saturation Voltage VCE(sat) - 1.8 2.5 V at IC=5A, IB=0.5A
Storage Time tstg - 250 500 ns

Instructions for Use:

  1. Mounting and Handling:

    • Ensure that the device is handled with care to avoid mechanical damage.
    • Use appropriate heat sinks to manage thermal resistance and ensure efficient heat dissipation.
  2. Electrical Connections:

    • Connect the collector, emitter, and base terminals correctly to avoid short circuits or incorrect polarity.
    • Use wire gauges suitable for the current ratings to prevent overheating.
  3. Thermal Management:

    • Operate the device within the specified temperature range to prevent thermal runaway.
    • Ensure adequate cooling, especially when operating at high power levels.
  4. Operational Parameters:

    • Do not exceed the maximum ratings for collector-emitter voltage, collector current, and power dissipation.
    • Check the saturation voltage and transition frequency to ensure the device operates efficiently in your application.
  5. Storage and Transportation:

    • Store the device in a dry, cool environment within the specified storage temperature range.
    • Avoid exposure to corrosive environments or excessive humidity.
  6. Testing and Inspection:

    • Perform regular testing and inspection to ensure the device is functioning within its specified parameters.
    • Use appropriate test equipment and methods to avoid damaging the device during testing.
(For reference only)

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