Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Collector-Emitter Voltage | VCE | - | - | 60 | V | Maximum voltage between collector and emitter with the base open. |
| Emitter-Base Voltage | VEB | -2 | - | 5 | V | Maximum voltage between emitter and base. |
| Collector-Base Voltage | VCB | - | - | 60 | V | Maximum voltage between collector and base with the emitter open. |
| Continuous Collector Current | IC | - | - | 1.5 | A | Maximum continuous current through the collector. |
| Pulse Collector Current | IC(P) | - | - | 3 | A | Maximum pulse current through the collector (tp = 1 ms). |
| Power Dissipation | PT | - | - | 625 | mW | Maximum power dissipation at TA = 25掳C. |
| Junction Temperature | TJ | -55 | - | 150 | 掳C | Operating temperature range for the junction. |
| Storage Temperature | TSTG | -65 | - | 150 | 掳C | Temperature range for storage. |
Instructions:
- Mounting: Ensure the transistor is mounted with adequate heat sinking if operating near maximum power dissipation.
- Biasing: Use appropriate biasing circuits to ensure the transistor operates within its safe operating area (SOA).
- Handling: Handle the device with care to avoid damage from electrostatic discharge (ESD).
- Soldering: Solder the device at a temperature not exceeding 260掳C for a duration of 10 seconds.
- Testing: Test the device under controlled conditions to verify its performance parameters.
- Storage: Store the device in a dry, cool place away from direct sunlight and sources of heat.
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