Details

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BUY DP8304BN. https://www.utsource.net/itm/p/12608012.html

Parameter	Description	Value
Device Type	High-Speed Power Management IC	-
Package	SOIC-8	-
Operating Voltage	Input Voltage Range	4.5V to 28V
Output Voltage	Adjustable Output Voltage	1.2V to 26V
Output Current	Maximum Continuous Output Current	1A
Quiescent Current	Typical Quiescent Current	45渭A
Shutdown Current	Shutdown Mode Current	0.1渭A
Enable Pin	Logic Low to Disable, Logic High to Enable	-
Thermal Shutdown	Thermal Protection Temperature	160掳C
Operating Temperature	Ambient Operating Temperature Range	-40掳C to 125掳C
Storage Temperature	Storage Temperature Range	-65掳C to 150掳C
PSRR	Power Supply Rejection Ratio at 1kHz	70dB
Line Regulation	Line Regulation (Vin = 4.5V to 28V)	卤0.1%
Load Regulation	Load Regulation (Iout = 0mA to 1A)	卤0.1%

Instructions for Use:

1. Power Supply Connection:

   • Connect the input voltage to the VIN pin.
   • Ensure the input voltage is within the operating range of 4.5V to 28V.
   • Connect the output voltage to the VOUT pin.

2. Output Voltage Adjustment:

   • Use an external resistor divider network connected to the FB (Feedback) pin to set the desired output voltage.
   • The formula to calculate the output voltage is ( V_ = V_ left(1 + fracright) ), where ( V_ ) is typically 1.2V.

3. Enable/Disable Control:

   • Connect the EN (Enable) pin to a logic high to enable the device.
   • Connect the EN pin to a logic low or leave it floating to disable the device.

4. Capacitors:

   • Place a 10渭F tantalum capacitor between the VIN and GND pins for input filtering.
   • Place a 10渭F tantalum capacitor between the VOUT and GND pins for output filtering.

5. Thermal Considerations:

   • Ensure adequate heat dissipation if operating at high output currents.
   • The device has built-in thermal shutdown protection to prevent damage from overheating.

6. Protection Features:

   • The device includes overcurrent protection and thermal shutdown to protect against short circuits and excessive power dissipation.

7. Layout Recommendations:

   • Keep the ground plane as large as possible to improve thermal performance.
   • Minimize trace lengths to reduce parasitic inductance and resistance.

8. Storage and Handling:

   • Store the device in a dry environment to prevent moisture damage.
   • Handle with care to avoid static discharge, which can damage the device.

(For reference only)