Details

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BUY FTA02N65 https://www.utsource.net/itm/p/12608044.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Drain-Source Voltage	VDS	-650	-	-	V
Gate-Source Voltage	VGS	-15	-	15	V
Continuous Drain Current	ID	-	2.0	-	A	@ TC = 25掳C
Pulse Drain Current	ID(peak)	-	4.7	-	A	@ TC = 25掳C, tp = 10 渭s, IG = 4 A
Power Dissipation	PTOT	-	-	93	W	@ TC = 25掳C
Junction Temperature	TJ	-	-	150	掳C
Storage Temperature	TSTG	-55	-	150	掳C
Thermal Resistance	R胃JC	-	1.5	-	掳C/W	Junction to Case
R胃JA	-	62	-	掳C/W	Junction to Ambient

Instructions for Use:

1. Voltage Ratings:

   • Ensure that the drain-source voltage (V_DS) does not exceed 650V.
   • The gate-source voltage (V_GS) should be within 卤15V.

2. Current Ratings:

   • The continuous drain current (I_D) should not exceed 2.0A at a case temperature of 25掳C.
   • For pulse applications, the peak drain current (I_D(peak)) can go up to 4.7A for a pulse duration of 10 渭s, with a gate current of 4A and a case temperature of 25掳C.

3. Power Dissipation:

   • The maximum power dissipation (P_TOT) is 93W at a case temperature of 25掳C. Ensure adequate heat sinking to manage power dissipation.

4. Temperature Limits:

   • The junction temperature (T_J) must not exceed 150掳C.
   • The storage temperature range (T_STG) is from -55掳C to 150掳C.

5. Thermal Management:

   • The thermal resistance from the junction to the case (R_胃JC) is 1.5掳C/W.
   • The thermal resistance from the junction to the ambient (R_胃JA) is 62掳C/W. Use appropriate heat sinks or cooling methods to maintain safe operating temperatures.

6. Handling Precautions:

   • Handle the device with care to avoid mechanical damage.
   • Use proper ESD protection to prevent damage from static electricity.
   • Follow recommended soldering profiles to avoid thermal stress during assembly.

7. Mounting:

   • Ensure that the device is securely mounted to the PCB and any necessary heat sinks.
   • Use thermal paste or other thermal interface materials to enhance heat transfer between the device and the heat sink.

8. Testing:

   • Perform initial testing under controlled conditions to verify proper operation.
   • Monitor temperature and current levels during operation to ensure they remain within specified limits.

(For reference only)