Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -10 | 800 | V | Maximum drain-to-source voltage | |
| Gate-Source Voltage | VGS(th) | 2.0 | 4.0 | 6.0 | V | Gate threshold voltage |
| Continuous Drain Current | ID | 17 | A | Continuous drain current at TC = 25掳C | ||
| Pulse Drain Current | IDM | 90 | A | Pulse drain current (t = 10 渭s, duty cycle = 1%) | ||
| Power Dissipation | PD | 230 | W | Maximum power dissipation | ||
| Junction Temperature | TJ | -55 | 175 | 掳C | Operating junction temperature range | |
| Storage Temperature | TSTG | -55 | 175 | 掳C | Storage temperature range |
Instructions for SPW17N80C2:
Handling Precautions:
- The SPW17N80C2 is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and installation.
Mounting and PCB Design:
- Ensure adequate heat sinking for the device if operating near its maximum power dissipation limits.
- Follow recommended PCB layout guidelines to minimize inductance and ensure stable operation.
Operating Conditions:
- Do not exceed the maximum ratings listed in the parameter table to avoid damage to the device.
- For reliable operation, keep the junction temperature within specified limits.
Gate Drive Requirements:
- Apply gate drive voltages within the specified range to ensure proper switching performance.
- Avoid applying excessive gate voltage to prevent gate oxide breakdown.
Switching Characteristics:
- Refer to the datasheet for detailed switching characteristics including turn-on and turn-off times.
- Optimize gate resistance (RG) for desired switching speed and efficiency.
Testing and Verification:
- Perform initial testing under controlled conditions to verify correct operation.
- Regularly monitor device performance parameters during operation.
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