Details

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BUY TLP350F https://www.utsource.net/itm/p/12608096.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Forward Voltage	VF	-	1.2	1.8	V	IF = 10 mA, TA = 25掳C
Reverse Voltage	VRRM	-	-	5	V	IF = 0 mA, TR = 25掳C
Forward Current	IF	-	-	30	mA	VR = 0 V, TR = 25掳C
Peak Forward Current	IF(surge)	-	-	100	mA	t = 10 ms, f = 1/10 Hz
Output Current	IC	-	-	1	A	VCE = 30 V, TA = 25掳C
Collector-Emitter Saturation Voltage	VCE(sat)	-	0.4	0.7	V	IC = 100 mA, IF = 5 mA, TA = 25掳C
Storage Temperature Range	TSTG	-40	-	110	掳C	-
Operating Temperature Range	TOP	-40	-	105	掳C	-

Instructions for Use:

1. Forward Voltage (V_F):

   • Ensure that the forward voltage does not exceed 1.8V at 10mA to avoid damaging the device.

2. Reverse Voltage (V_RRM):

   • The device can withstand up to 5V in reverse bias without damage.

3. Forward Current (I_F):

   • Do not exceed 30mA continuous forward current to prevent overheating and potential failure.

4. Peak Forward Current (I_F(surge)):

   • The device can handle peak currents up to 100mA for short durations (10ms) at a frequency of 1/10 Hz.

5. Output Current (I_C):

   • The maximum output current is 1A. Ensure that the load does not draw more than this to avoid damage.

6. Collector-Emitter Saturation Voltage (V_CE(sat)):

   • When operating at 100mA collector current and 5mA forward current, the saturation voltage should be between 0.4V and 0.7V.

7. Storage Temperature Range (T_STG):

   • Store the device in an environment where the temperature ranges from -40掳C to 110掳C.

8. Operating Temperature Range (T_OP):

   • The device is designed to operate within a temperature range of -40掳C to 105掳C. Ensure that the ambient temperature does not exceed these limits during operation.

9. Mounting and Handling:

   • Handle the device with care to avoid mechanical stress or damage.
   • Follow standard ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.

10. Soldering:

    • Use appropriate soldering techniques and temperatures to avoid thermal shock.
    • Soldering temperature should not exceed 260掳C for more than 10 seconds.

11. Testing:

    • Before integrating the device into a circuit, test it under controlled conditions to ensure it meets the specified parameters.

(For reference only)