Details
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Below is the parameter table and instructions for the IRGP4630D MOSFET:
Parameter Table
| Parameter | Symbol | Min | Typ | Max | Unit | Test Conditions |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | ( V_ ) | - | 600 | - | V | |
| Gate-Source Voltage | ( V_ ) | -15 | 0 | 20 | V | |
| Continuous Drain Current | ( I_ ) | - | 24 | - | A | ( T_ = 25^circ C ) |
| Pulsed Drain Current | ( I_{D_{(p)}} ) | - | 110 | - | A | ( t_ = 10 mu s, I_ = 10 A ) |
| Total Power Dissipation | ( P_ ) | - | 250 | - | W | ( T_ = 25^circ C ) |
| Junction Temperature | ( T_ ) | - | - | 175 | ( ^circ C ) | |
| Storage Temperature | ( T_ ) | -55 | - | 150 | ( ^circ C ) | |
| Thermal Resistance | ( R_{theta JC} ) | - | 0.68 | - | ( ^circ C/W ) | |
| Input Capacitance | ( C_ ) | - | 1650 | - | pF | ( V_ = 400 V, f = 1 MHz ) |
| Output Capacitance | ( C_ ) | - | 100 | - | pF | ( V_ = 400 V, f = 1 MHz ) |
| Gate Charge | ( Q_g ) | - | 90 | - | nC | ( V_ = 15 V, V_ = 400 V ) |
| Threshold Voltage | ( V_{GS(th)} ) | 2.0 | 4.0 | 6.0 | V | ( I_D = 1 mA, I_G = 0.5 mA ) |
| On-State Resistance | ( R_{DS(on)} ) | - | 0.18 | - | (Omega) | ( V_ = 10 V, I_D = 24 A ) |
| Gate-Source Leakage Current | ( I_ ) | - | - | 100 | nA | ( V_ = 卤20 V ) |
| Drain-Source Leakage Current | ( I_ ) | - | - | 10 | (mu A) | ( V_ = 600 V, T_J = 25^circ C ) |
Instructions
Handling and Storage:
- Store the device in a dry, cool place.
- Handle with care to avoid static damage. Use ESD (Electrostatic Discharge) protection when handling.
Mounting:
- Ensure proper thermal management by using a heatsink if necessary.
- Apply thermal paste between the device and the heatsink for better heat dissipation.
Soldering:
- Preheat the PCB to reduce thermal shock.
- Use a soldering iron with a temperature of 300掳C to 350掳C.
- Soldering time should not exceed 10 seconds per joint.
Biasing:
- Ensure that the gate-source voltage (( V_ )) is within the specified range to prevent damage.
- Use appropriate gate drive circuits to ensure reliable operation.
Operation:
- Do not exceed the maximum drain-source voltage (( V_ )) or continuous drain current (( I_D )).
- Monitor the junction temperature (( T_J )) to ensure it does not exceed 175掳C.
Testing:
- Test the device under controlled conditions to verify its performance.
- Use a suitable load to simulate real-world operating conditions.
Safety:
- Always follow safety guidelines when working with high voltages and currents.
- Use appropriate personal protective equipment (PPE) as needed.
By following these parameters and instructions, you can ensure the reliable and safe operation of the IRGP4630D MOSFET.
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