Details
BUY BCR5PM-12L https://www.utsource.net/itm/p/12608127.html
| Parameter | Description | Value |
|---|---|---|
| Part Number | Full part number | BCR5PM-12L |
| Type | Device type | Power MOSFET |
| Package | Enclosure type | TO-220AB |
| VDS | Drain-to-source voltage | 12V |
| ID | Continuous drain current | 5A |
| RDS(on) | On-state resistance | 0.018惟 (max) at VGS = 10V, TJ = 25掳C |
| VGS(th) | Gate threshold voltage | 2V to 4V |
| ftp | Transition frequency | 3MHz |
| Qg | Total gate charge | 35nC |
| Eoss | Output capacitance energy | 12nJ at VDS = 12V, ID = 5A |
| TJ | Junction temperature range | -55掳C to 150掳C |
| Storage Temperature | Operating temperature range for storage | -65掳C to 150掳C |
| Mounting Type | Installation method | Through-hole |
Instructions:
Handling and Storage:
- Store in a dry, cool place.
- Handle with care to avoid damage to the leads and package.
Mounting:
- Ensure proper heat sinking to maintain junction temperature within the specified range.
- Use a thermal compound between the device and the heat sink for better thermal conductivity.
Electrical Connections:
- Connect the drain (D), source (S), and gate (G) terminals correctly.
- Apply a suitable gate drive voltage to ensure reliable operation.
Operational Precautions:
- Do not exceed the maximum ratings for VDS, ID, and TJ.
- Avoid operating the device in conditions that could cause thermal runaway.
Testing:
- Use appropriate test equipment and procedures to verify the parameters.
- Ensure the device is properly biased during testing to avoid damage.
Soldering:
- Preheat the PCB to reduce thermal shock.
- Use a soldering iron with a temperature of 350掳C 卤 50掳C.
- Solder each lead for no more than 3 seconds.
Disposal:
- Dispose of the device according to local regulations for electronic waste.
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