Details

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BUY TPQ3904 https://www.utsource.net/itm/p/12608159.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VCC	2.7	-	5.5	V	Operating supply voltage range
Output Current	IOUT	-	100	200	mA	Continuous output current
Quiescent Current	IQ	-	1.5	2.5	mA	Current consumption in active state
Shutdown Current	ISD	-	0.1	0.5	渭A	Current consumption in shutdown mode
Dropout Voltage	VDO	-	0.3	0.6	V	Voltage difference between input and output when fully loaded
Thermal Shutdown Temperature	TSD	-	150	170	掳C	Temperature at which the device enters thermal shutdown
Operating Junction Temperature	TJ	-40	-	125	掳C	Range of operating temperatures for the junction
Storage Temperature	TSTG	-65	-	150	掳C	Range of temperatures for storage

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage (V_CC) is within the specified range of 2.7V to 5.5V.
   • Do not exceed the maximum voltage to avoid damaging the device.

2. Output Current:

   • The device can provide a continuous output current of up to 200mA. For reliable operation, keep the output current below this limit.
   • Higher currents may cause the device to overheat or enter thermal shutdown.

3. Quiescent Current:

   • The quiescent current (I_Q) is typically 1.5mA but can go up to 2.5mA. This is the current consumed by the device when it is active but not providing any load current.

4. Shutdown Current:

   • When the device is in shutdown mode, the current consumption (I_SD) is very low, typically 0.1渭A but can go up to 0.5渭A.
   • Use the shutdown feature to reduce power consumption when the device is not needed.

5. Dropout Voltage:

   • The dropout voltage (V_DO) is the minimum voltage difference required between the input and output for the device to regulate properly.
   • Typically, this is around 0.3V but can go up to 0.6V under full load conditions.

6. Thermal Shutdown:

   • The device will enter thermal shutdown if the junction temperature (T_J) exceeds 150掳C.
   • To prevent thermal shutdown, ensure adequate heat dissipation, especially when operating at high output currents.

7. Operating and Storage Temperatures:

   • The operating junction temperature (T_J) should be kept within the range of -40掳C to 125掳C.
   • The device can be stored in temperatures ranging from -65掳C to 150掳C.

8. Handling and Storage:

   • Handle the device with care to avoid static damage.
   • Store the device in a dry, cool place to prevent moisture damage.

9. Mounting:

   • Mount the device on a PCB with proper soldering techniques to ensure good thermal and electrical connections.
   • Use a heatsink if necessary to manage heat dissipation, especially in high-power applications.

10. Testing:

    • Test the device under typical operating conditions to ensure it meets the required specifications.
    • Verify the output voltage and current to ensure the device is functioning correctly.

(For reference only)