2SK2255

2SK2255


Specifications
SKU
12608164
Details

BUY 2SK2255 https://www.utsource.net/itm/p/12608164.html

Below is the parameter table and instructions for the 2SK2255 MOSFET:

2SK2255 Parameter Table

Parameter Symbol Min Typ Max Unit Conditions
Drain-Source Voltage ( V_ ) - - 450 V -
Gate-Source Voltage ( V_ ) - - 卤20 V -
Continuous Drain Current ( I_ ) - - 8 A ( T_C = 25^circ C )
Continuous Drain Current ( I_ ) - - 5 A ( T_C = 100^circ C )
Pulse Drain Current ( I_{D(pulse)} ) - - 24 A ( t = 10 text{ ms, } T_C = 25^circ C )
Gate Threshold Voltage ( V_{GS(th)} ) 2.0 3.0 4.0 V ( I_D = 1 text )
On-State Resistance ( R_{DS(on)} ) - 0.65 - ( V_ = 10 text, I_D = 5 text )
Input Capacitance ( C_ ) - 1500 - pF ( V_ = 0 text )
Output Capacitance ( C_ - 220 - pF ( V_ = 300 text )
Reverse Transfer Capacitance ( C_ ) - 250 - pF ( V_ = 300 text )
Total Gate Charge ( Q_g ) - 75 - nC ( V_ = 300 text, I_D = 5 text )
Maximum Junction Temperature ( T_J ) - - 150 掳C -
Storage Temperature Range ( T_ ) -55 - 150 掳C -

Instructions for Use

  1. Handling and Storage:

    • Handle the 2SK2255 with care to avoid static damage.
    • Store in a dry, cool place within the specified storage temperature range.
  2. Mounting:

    • Ensure proper heat sinking to manage the thermal resistance and keep the junction temperature within safe limits.
    • Use a thermal compound between the device and the heat sink for better thermal conductivity.
  3. Biasing:

    • Apply the gate-source voltage (( V_ )) within the specified limits to avoid damaging the gate oxide.
    • Ensure that the gate-source voltage does not exceed 卤20V to prevent gate breakdown.
  4. Current Limiting:

    • Do not exceed the continuous drain current ratings (( I_D )) at the specified case temperatures.
    • For pulse applications, ensure the pulse duration and current do not exceed the specified values to avoid overheating.
  5. Capacitance Management:

    • Consider the input, output, and reverse transfer capacitances when designing the circuit to minimize switching losses and ensure stable operation.
  6. Thermal Management:

    • Monitor the junction temperature (( T_J )) to ensure it does not exceed 150掳C.
    • Use appropriate cooling methods (e.g., forced air, liquid cooling) if necessary.
  7. Testing:

    • Test the device under controlled conditions to verify its performance parameters.
    • Use a curve tracer or similar equipment to measure the on-state resistance and other key parameters.

By following these instructions, you can ensure reliable and efficient operation of the 2SK2255 MOSFET in your application.

(For reference only)

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