Details
BUY PT5126 https://www.utsource.net/itm/p/12608166.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Input Voltage | VIN | 2.7 | - | 5.5 | V | Operating input voltage range |
| Output Voltage | VOUT | - | 3.3 | - | V | Fixed output voltage |
| Output Current | IOUT | - | 1.2 | 1.5 | A | Continuous output current |
| Efficiency | 畏 | - | 90 | - | % | Typical efficiency at full load |
| Quiescent Current | IQ | - | 40 | - | 渭A | Quiescent current |
| Dropout Voltage | VDROPOUT | - | 200 | 300 | mV | Dropout voltage at 1.2A |
| Operating Temp. | TOPR | -40 | - | 85 | 掳C | Operating temperature range |
| Storage Temp. | TSTG | -40 | - | 125 | 掳C | Storage temperature range |
| Package | - | - | - | - | SOT23-5 | Package type |
Instructions for Use
Input Connection:
- Connect the positive terminal of the power supply to the
VINpin. - Connect the negative terminal (ground) of the power supply to the
GNDpin.
- Connect the positive terminal of the power supply to the
Output Connection:
- Connect the load to the
VOUTpin. - Ensure the ground of the load is connected to the
GNDpin.
- Connect the load to the
Capacitors:
- Place a 1渭F ceramic capacitor between
VINandGNDas close to the IC as possible. - Place a 1渭F ceramic capacitor between
VOUTandGNDas close to the IC as possible.
- Place a 1渭F ceramic capacitor between
Thermal Considerations:
- Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.
- The IC can operate up to 85掳C, but performance may degrade at higher temperatures.
Protection Features:
- The PT5126 includes overcurrent protection and thermal shutdown to prevent damage under fault conditions.
Layout Recommendations:
- Keep the layout compact to minimize parasitic inductance and capacitance.
- Use wide traces for power and ground connections to reduce resistance and improve heat dissipation.
Storage:
- Store the IC in a dry environment within the specified storage temperature range to avoid damage.
Handling:
- Handle the IC with care to avoid static discharge, which can damage the device.
- Use proper ESD (Electrostatic Discharge) protection when handling the IC.
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