2SK1157

2SK1157


Specifications
SKU
12608170
Details

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Parameter Symbol Min Typical Max Unit Conditions
Drain-Source Voltage VDS - - 500 V -
Gate-Source Voltage VGS - - ±20 V -
Continuous Drain Current ID - 4.0 - A TC = 25°C
Continuous Drain Current ID - 2.0 - A TC = 100°C
Pulse Drain Current ID(p) - 8.0 - A tp = 10 ms, f ≤ 1 Hz
Transconductance gfs 0.6 - 2.0 S VDS = 25V, ID = 1A
Input Capacitance Ciss - 1300 - pF VDS = 0V
Output Capacitance Coss - 250 - pF VDS = 25V
Reverse Transfer Capacitance Crss - 25 - pF VDS = 25V
Total Gate Charge Qg - 45 - nC VGS = 10V
Gate-Source Threshold Voltage VGS(th) 1.0 2.0 4.0 V ID = 1 mA
Junction Temperature TJ - - 150 °C -
Storage Temperature Tstg -55 - 150 °C -

Instructions for Use:

  1. Handling Precautions:

    • The 2SK1157 is sensitive to electrostatic discharge (ESD). Use proper ESD protection during handling and installation.
    • Avoid exceeding the maximum ratings specified in the table to prevent damage to the device.
  2. Mounting:

    • Ensure good thermal management by using appropriate heat sinks or heatsink compounds to maintain the junction temperature within the specified limits.
    • Follow the recommended soldering profile to avoid thermal shock and ensure reliable connections.
  3. Biasing:

    • Apply the gate-source voltage (VGS) carefully to stay within the safe operating area. Exceeding the maximum VGS can cause immediate damage.
    • Ensure the drain-source voltage (VDS) does not exceed the maximum rating, especially during transient conditions.
  4. Operation:

    • Monitor the drain current (ID) to ensure it does not exceed the continuous or pulse ratings depending on the application.
    • For high-frequency applications, consider the parasitic capacitances (Ciss, Coss, Crss) to optimize performance.
  5. Storage:

    • Store the device in a dry, cool environment to prevent moisture absorption and degradation.
    • Keep the device in its original packaging until ready for use to protect against static and physical damage.
  6. Testing:

    • Use appropriate test equipment and methods to verify the device parameters. Ensure the test conditions match those specified in the datasheet for accurate results.
(For reference only)

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