Details
BUY 2SK1157 https://www.utsource.net/itm/p/12608170.html
| Parameter | Symbol | Min | Typical | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | - | 500 | V | - |
| Gate-Source Voltage | VGS | - | - | ±20 | V | - |
| Continuous Drain Current | ID | - | 4.0 | - | A | TC = 25°C |
| Continuous Drain Current | ID | - | 2.0 | - | A | TC = 100°C |
| Pulse Drain Current | ID(p) | - | 8.0 | - | A | tp = 10 ms, f ≤ 1 Hz |
| Transconductance | gfs | 0.6 | - | 2.0 | S | VDS = 25V, ID = 1A |
| Input Capacitance | Ciss | - | 1300 | - | pF | VDS = 0V |
| Output Capacitance | Coss | - | 250 | - | pF | VDS = 25V |
| Reverse Transfer Capacitance | Crss | - | 25 | - | pF | VDS = 25V |
| Total Gate Charge | Qg | - | 45 | - | nC | VGS = 10V |
| Gate-Source Threshold Voltage | VGS(th) | 1.0 | 2.0 | 4.0 | V | ID = 1 mA |
| Junction Temperature | TJ | - | - | 150 | °C | - |
| Storage Temperature | Tstg | -55 | - | 150 | °C | - |
Instructions for Use:
Handling Precautions:
- The 2SK1157 is sensitive to electrostatic discharge (ESD). Use proper ESD protection during handling and installation.
- Avoid exceeding the maximum ratings specified in the table to prevent damage to the device.
Mounting:
- Ensure good thermal management by using appropriate heat sinks or heatsink compounds to maintain the junction temperature within the specified limits.
- Follow the recommended soldering profile to avoid thermal shock and ensure reliable connections.
Biasing:
- Apply the gate-source voltage (VGS) carefully to stay within the safe operating area. Exceeding the maximum VGS can cause immediate damage.
- Ensure the drain-source voltage (VDS) does not exceed the maximum rating, especially during transient conditions.
Operation:
- Monitor the drain current (ID) to ensure it does not exceed the continuous or pulse ratings depending on the application.
- For high-frequency applications, consider the parasitic capacitances (Ciss, Coss, Crss) to optimize performance.
Storage:
- Store the device in a dry, cool environment to prevent moisture absorption and degradation.
- Keep the device in its original packaging until ready for use to protect against static and physical damage.
Testing:
- Use appropriate test equipment and methods to verify the device parameters. Ensure the test conditions match those specified in the datasheet for accurate results.
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