AP7362A-HA-7

AP7362A-HA-7


Specifications
SKU
12608189
Details

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Parameter Symbol Min Typ Max Unit Notes
Input Voltage VIN 2.5 - 5.5 V
Output Voltage VOUT 1.2 - 3.3 V Adjustable
Quiescent Current IQ - 40 - 渭A
Shutdown Current ISD - 0.1 - 渭A
Output Current (Max) IOUT - 600 - mA
Dropout Voltage VDROPOUT - 200 - mV @ IOUT = 300mA
Operating Temperature TOPR -40 - 85 掳C
Storage Temperature TSTG -65 - 150 掳C

Instructions:

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 2.5V to 5.5V.
    • Do not exceed the maximum input voltage to avoid damage to the device.
  2. Output Voltage (VOUT):

    • The output voltage can be adjusted between 1.2V and 3.3V using external resistors.
    • Use the formula: ( V_ = 1.2V times left(1 + fracright) ) to set the desired output voltage.
  3. Quiescent Current (IQ):

    • The quiescent current is typically 40 渭A. This is the current consumed by the device when it is active but not driving any load.
  4. Shutdown Current (ISD):

    • When the shutdown pin is pulled low, the device enters a low-power mode with a shutdown current of 0.1 渭A.
  5. Output Current (IOUT):

    • The maximum output current is 600 mA. Ensure that the load does not exceed this limit to prevent overheating or damage.
  6. Dropout Voltage (VDROPOUT):

    • The dropout voltage is typically 200 mV at an output current of 300 mA. This is the minimum difference between the input and output voltages required for the regulator to maintain regulation.
  7. Operating Temperature (TOPR):

    • The operating temperature range is from -40掳C to 85掳C. Ensure that the device operates within this range to avoid performance degradation or failure.
  8. Storage Temperature (TSTG):

    • The storage temperature range is from -65掳C to 150掳C. Store the device in this range to prevent damage.
  9. Mounting and Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow proper soldering techniques to ensure reliable connections and prevent thermal stress on the device.
  10. Testing:

    • After assembly, test the device under typical operating conditions to ensure it meets the specified parameters.
    • Verify the output voltage and current capabilities before connecting to the final application.
(For reference only)

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