Details
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Below is the parameter table and instructions for the NTD2955G MOSFET:
NTD2955G Parameter Table
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | - | 60 | V | |
| Gate-Source Voltage | VGS | -10 | - | 20 | V | |
| Continuous Drain Current | ID | - | 37 | - | A | TC = 25掳C |
| Continuous Drain Current | ID | - | 26 | - | A | TC = 100掳C |
| Pulse Drain Current (tp = 10ms) | ID(p) | - | 74 | - | A | TC = 25掳C |
| Power Dissipation | PD | - | - | 220 | W | TC = 25掳C |
| Junction Temperature | TJ | - | - | 150 | 掳C | |
| Storage Temperature Range | TSTG | -55 | - | 150 | 掳C | |
| Gate Charge | QG | - | 87 | - | nC | VGS = 10V, ID = 10A |
| Input Capacitance | Ciss | - | 1650 | - | pF | VDS = 25V, f = 1MHz |
| Output Capacitance | Coss | - | 450 | - | pF | VDS = 25V, f = 1MHz |
| Reverse Transfer Capacitance | Crss | - | 110 | - | pF | VDS = 25V, f = 1MHz |
| Threshold Voltage | VGS(th) | 2.0 | 2.5 | 3.0 | V | ID = 250渭A |
| On-State Resistance | RDS(on) | - | 0.018 | - | 惟 | VGS = 10V, ID = 37A |
| Maximum Junction-to-Case Thermal Resistance | R胃JC | - | - | 0.5 | 掳C/W |
Instructions for NTD2955G
Handling and Storage:
- Handle the device with care to avoid damage to the leads and body.
- Store in a dry environment within the specified storage temperature range (-55掳C to 150掳C).
Mounting:
- Ensure proper thermal management by using a heatsink if necessary, especially when operating at high power levels.
- Use appropriate soldering techniques to avoid thermal shock and ensure good electrical connections.
Biasing:
- Apply the gate-source voltage (VGS) within the specified limits (-10V to 20V).
- Ensure that the drain-source voltage (VDS) does not exceed 60V.
Current Handling:
- Do not exceed the continuous drain current (ID) ratings for the given case temperature.
- For pulse operation, ensure that the pulse duration and frequency are within the safe operating area (SOA).
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it does not exceed 150掳C.
- Use thermal paste or thermal interface materials between the device and the heatsink for better heat dissipation.
Testing:
- When testing the device, use appropriate test equipment and follow safety guidelines to prevent damage to the device or injury to personnel.
ESD Protection:
- The device is sensitive to electrostatic discharge (ESD). Use ESD protection measures such as wrist straps and grounded work surfaces.
Datasheet and Additional Information:
- Refer to the full datasheet for more detailed information and application notes.
By following these instructions, you can ensure reliable and efficient operation of the NTD2955G MOSFET.
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