NTD2955G

NTD2955G


Specifications
SKU
12608211
Details

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Below is the parameter table and instructions for the NTD2955G MOSFET:

NTD2955G Parameter Table

Parameter Symbol Min Typ Max Unit Conditions
Drain-Source Voltage VDS - - 60 V
Gate-Source Voltage VGS -10 - 20 V
Continuous Drain Current ID - 37 - A TC = 25掳C
Continuous Drain Current ID - 26 - A TC = 100掳C
Pulse Drain Current (tp = 10ms) ID(p) - 74 - A TC = 25掳C
Power Dissipation PD - - 220 W TC = 25掳C
Junction Temperature TJ - - 150 掳C
Storage Temperature Range TSTG -55 - 150 掳C
Gate Charge QG - 87 - nC VGS = 10V, ID = 10A
Input Capacitance Ciss - 1650 - pF VDS = 25V, f = 1MHz
Output Capacitance Coss - 450 - pF VDS = 25V, f = 1MHz
Reverse Transfer Capacitance Crss - 110 - pF VDS = 25V, f = 1MHz
Threshold Voltage VGS(th) 2.0 2.5 3.0 V ID = 250渭A
On-State Resistance RDS(on) - 0.018 - VGS = 10V, ID = 37A
Maximum Junction-to-Case Thermal Resistance R胃JC - - 0.5 掳C/W

Instructions for NTD2955G

  1. Handling and Storage:

    • Handle the device with care to avoid damage to the leads and body.
    • Store in a dry environment within the specified storage temperature range (-55掳C to 150掳C).
  2. Mounting:

    • Ensure proper thermal management by using a heatsink if necessary, especially when operating at high power levels.
    • Use appropriate soldering techniques to avoid thermal shock and ensure good electrical connections.
  3. Biasing:

    • Apply the gate-source voltage (VGS) within the specified limits (-10V to 20V).
    • Ensure that the drain-source voltage (VDS) does not exceed 60V.
  4. Current Handling:

    • Do not exceed the continuous drain current (ID) ratings for the given case temperature.
    • For pulse operation, ensure that the pulse duration and frequency are within the safe operating area (SOA).
  5. Thermal Management:

    • Monitor the junction temperature (TJ) to ensure it does not exceed 150掳C.
    • Use thermal paste or thermal interface materials between the device and the heatsink for better heat dissipation.
  6. Testing:

    • When testing the device, use appropriate test equipment and follow safety guidelines to prevent damage to the device or injury to personnel.
  7. ESD Protection:

    • The device is sensitive to electrostatic discharge (ESD). Use ESD protection measures such as wrist straps and grounded work surfaces.
  8. Datasheet and Additional Information:

    • Refer to the full datasheet for more detailed information and application notes.

By following these instructions, you can ensure reliable and efficient operation of the NTD2955G MOSFET.

(For reference only)

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