Details

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BUY HEF40098BP https://www.utsource.net/itm/p/12608273.html

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VDD)	Operating supply voltage range	3	-	15	V
Input Voltage (VIH)	High-level input voltage	2	-	VDD	V
Input Voltage (VIL)	Low-level input voltage	0	-	0.8	V
Output Voltage (VOH)	High-level output voltage	-	-	VDD - 0.5	V
Output Voltage (VOL)	Low-level output voltage	0	-	0.5	V
Input Current (IIN)	Input current per pin	-1	0	1	渭A
Output Current (IOUT)	Output current per pin	-10	-	10	mA
Propagation Delay Time (tpd)	Propagation delay time	-	40	-	ns
Power Dissipation (PD)	Maximum power dissipation	-	-	700	mW
Operating Temperature Range (TA)	Ambient operating temperature range	-40	-	85	掳C
Storage Temperature Range (TSTG)	Storage temperature range	-65	-	150	掳C

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage is within the specified range (3V to 15V) to avoid damage to the device.

2. Input Voltages:

   • High-level input voltage (V_IH) should be at least 2V and can go up to the supply voltage (V_DD).
   • Low-level input voltage (V_IL) should not exceed 0.8V.

3. Output Voltages:

   • High-level output voltage (V_OH) will be close to the supply voltage (V_DD) minus 0.5V.
   • Low-level output voltage (V_OL) will be no more than 0.5V.

4. Current Ratings:

   • Input current (I_IN) per pin should not exceed 卤1渭A.
   • Output current (I_OUT) per pin should not exceed 卤10mA.

5. Propagation Delay:

   • The propagation delay time (t_pd) is typically 40ns, which is the time it takes for a signal to propagate through the device.

6. Power Dissipation:

   • The maximum power dissipation (P_D) is 700mW. Ensure proper heat dissipation if operating near this limit.

7. Temperature Ranges:

   • The ambient operating temperature range (T_A) is from -40掳C to 85掳C.
   • The storage temperature range (T_STG) is from -65掳C to 150掳C.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Follow standard ESD (Electrostatic Discharge) precautions when handling the device.

9. Mounting:

   • Ensure proper mounting and soldering techniques to prevent mechanical stress on the device.
   • Use appropriate thermal management techniques if the device is expected to operate at high temperatures or high power levels.

10. Testing:

    • Test the device under typical operating conditions to ensure it meets the specified parameters.
    • Refer to the datasheet for detailed test procedures and additional information.

(For reference only)