Details
BUY MK4116N-3GP https://www.utsource.net/itm/p/12608276.html
| Parameter | Description | Value | Unit |
|---|---|---|---|
| Part Number | Part Number | MK4116N-3GP | |
| Type | Type of Component | MOSFET | |
| Package | Package Type | TO-220 | |
| Polarity | Polarity | N-Channel | |
| VDS (Max) | Drain-Source Voltage | 60 | V |
| VGS (Max) | Gate-Source Voltage | 卤20 | V |
| ID (Max) | Continuous Drain Current | 16 | A |
| RDS(on) | On-State Resistance at VGS = 10V | 0.075 | 惟 |
| Power Dissipation | Maximum Power Dissipation | 100 | W |
| Operating Temperature | Operating Junction Temperature Range | -55 to +150 | 掳C |
| Storage Temperature | Storage Temperature Range | -65 to +150 | 掳C |
| Thermal Resistance | Junction to Case Thermal Resistance | 1.5 | 掳C/W |
| Gate Charge | Total Gate Charge | 110 | nC |
| Input Capacitance | Input Capacitance at VDS = 25V, f = 1MHz | 1500 | pF |
| Output Capacitance | Output Capacitance at VDS = 25V, f = 1MHz | 350 | pF |
| Reverse Transfer Capacitance | Reverse Transfer Capacitance at VDS = 25V, f = 1MHz | 50 | pF |
Instructions for Use:
Handling Precautions:
- Handle with care to avoid damage to the leads and body.
- Use ESD (Electrostatic Discharge) protection when handling the device.
Mounting:
- Ensure proper alignment of the device during soldering.
- Use a heat sink if necessary to manage thermal dissipation.
Soldering:
- Soldering temperature should not exceed 260掳C for more than 10 seconds.
- Avoid reflow soldering more than twice.
Testing:
- Test the device under specified conditions to ensure it meets the required parameters.
- Use appropriate test equipment to avoid damage.
Storage:
- Store in a dry, cool place away from direct sunlight.
- Follow recommended storage temperature ranges to prevent degradation.
Application:
- Suitable for high-power switching applications such as power supplies, motor control, and inverters.
- Ensure that the operating conditions do not exceed the maximum ratings.
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