Details

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BUY K4H511638J-LCB3000 https://www.utsource.net/itm/p/12608323.html

Parameter	Description
Device Type	512Mb DDR3 SDRAM
Package	FBGA (Fine Pitch Ball Grid Array)
Density	512 Mbit (64M x 8)
Voltage (Vcc)	1.35V / 1.5V
Operating Temperature Range	-40掳C to +85掳C
Data Rate	Up to 1600 MT/s
CAS Latency (CL)	11, 13
Row Address Strobe (RAS) Precharge Time (tRP)	13.125ns (CL=11), 15ns (CL=13)
Row Active to Row Active Delay (tRRD)	7.5ns (CL=11), 9ns (CL=13)
Refresh Cycle Time (tRFC)	64ms (CL=11), 64ms (CL=13)
Power Down Mode	Supports both self-refresh and deep power-down modes

Instructions:

1. Installation: Ensure the device is installed in a compatible motherboard slot that supports DDR3 memory standards.
2. Voltage Setting: Set the system voltage to either 1.35V or 1.5V as required by the system specifications.
3. Timing Configuration: Configure the memory timings according to the CAS latency supported by your system. Use the provided timing parameters for optimal performance.
4. Temperature Management: Operate within the specified temperature range to ensure reliable operation. Consider adequate cooling solutions if operating near the upper limit.
5. Power Management: Utilize the power down modes to reduce power consumption when the memory is not actively being used.
6. Compatibility: Verify compatibility with the system BIOS/UEFI settings to ensure proper initialization and configuration of the memory module.

(For reference only)