Details

---

BUY 74HCT646AP https://www.utsource.net/itm/p/12608373.html

Parameter	Symbol	Min	Typical	Max	Unit	Condition
Supply Voltage	VCC	2.0	-	5.5	V	-
Input Low Voltage	VIL	-	0.8	-	V	VCC = 4.5V to 5.5V
Input High Voltage	VIH	-	2.0	-	V	VCC = 4.5V to 5.5V
Output Low Voltage	VOL	-	0.1	0.4	V	IOL = 16mA, VCC = 4.5V to 5.5V
Output High Voltage	VOH	4.4	-	-	V	IOH = -0.4mA, VCC = 4.5V to 5.5V
Input Leakage Current	IIL	-	卤1	-	渭A	VCC = 4.5V to 5.5V
Output Leakage Current	IOL	-	卤100	-	nA	VCC = 4.5V to 5.5V
Propagation Delay Time	tpd	-	14	30	ns	VCC = 5.0V, VOH = 3.5V, VOL = 1.5V, IL = 16mA, IH = -0.4mA
Power Dissipation	PD	-	-	100	mW	Per Package
Operating Temperature Range	TA	-40	-	85	掳C	-
Storage Temperature Range	TSTG	-65	-	150	掳C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.0V to 5.5V.
   • Connect the ground (GND) pin to the system ground.

2. Input Signals:

   • Input signals should be within the valid logic levels:
     • Low (V_IL): 0.8V or less at V_CC = 4.5V to 5.5V.
     • High (V_IH): 2.0V or more at V_CC = 4.5V to 5.5V.
   • Avoid floating inputs; tie them to a known state (high or low) if not actively driven.

3. Output Signals:

   • Output low (V_OL) should be 0.4V or less when sourcing 16mA.
   • Output high (V_OH) should be 4.4V or more when sinking -0.4mA.
   • Ensure the load does not exceed the maximum current ratings.

4. Propagation Delay:

   • The typical propagation delay time (t_pd) is 14ns under standard conditions.
   • Consider this delay when designing timing-sensitive circuits.

5. Temperature:

   • Operate the device within the temperature range of -40掳C to 85掳C.
   • Store the device between -65掳C and 150掳C.

6. Power Dissipation:

   • Ensure that the power dissipation per package does not exceed 100mW to avoid overheating.
   • Use appropriate heat sinks or cooling methods if necessary.

7. Handling:

   • Handle the device with care to avoid static damage.
   • Follow ESD (Electrostatic Discharge) precautions during handling and assembly.

8. Testing:

   • Test the device under specified conditions to ensure proper functionality.
   • Use recommended test setups and procedures to validate performance.

(For reference only)