Details

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BUY 2VPPCB170 https://www.utsource.net/itm/p/12608429.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Input Voltage	Vin	2.0	-	5.5	V	Operating input voltage range
Output Voltage	Vout	1.8	-	3.6	V	Adjustable output voltage
Output Current	Iout	-	170	-	mA	Maximum continuous output current
Quiescent Current	IQ	-	1.5	-	渭A	Typical quiescent current
Dropout Voltage	Vdo	-	200	-	mV	Typical dropout voltage at Iout = 170mA
Load Regulation	-	-	0.5	-	%	Change in Vout with load
Line Regulation	-	-	0.1	-	%/V	Change in Vout with Vin
Ripple Rejection	-	50	70	-	dB	Attenuation of input ripple
Operating Temperature	Toper	-40	-	125	掳C	Operating temperature range
Storage Temperature	Tstg	-65	-	150	掳C	Storage temperature range

Instructions for Use:

1. Input Voltage (Vin):

   • Ensure the input voltage is within the specified range (2.0V to 5.5V) to avoid damage to the device.

2. Output Voltage (Vout):

   • Adjust the output voltage using external resistors according to the datasheet formula: ( V_ = 1.23 left(1 + fracright) ).
   • Verify the output voltage with a multimeter after setting the resistors.

3. Output Current (Iout):

   • The device can provide up to 170mA continuously. Ensure the load does not exceed this limit to prevent overheating or damage.

4. Quiescent Current (IQ):

   • The typical quiescent current is 1.5渭A. This low current draw makes the device suitable for battery-powered applications.

5. Dropout Voltage (Vdo):

   • The typical dropout voltage is 200mV at full load. Ensure the input voltage is at least 200mV higher than the desired output voltage.

6. Load and Line Regulation:

   • The load regulation is 0.5%, and the line regulation is 0.1%/V. These parameters ensure stable output voltage under varying load and input conditions.

7. Ripple Rejection:

   • The device provides 50dB to 70dB of ripple rejection, effectively filtering out input voltage noise.

8. Operating and Storage Temperature:

   • The device operates reliably between -40掳C and 125掳C and can be stored between -65掳C and 150掳C.

9. PCB Layout:

   • Use a ground plane to improve thermal performance and reduce noise.
   • Place bypass capacitors close to the input and output pins to minimize transient effects.

10. Handling:

    • Handle the device with care to avoid static damage. Use proper ESD protection measures during assembly and handling.

(For reference only)