Details

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BUY TSB81BA3E https://www.utsource.net/itm/p/12608437.html

Parameter	Symbol	Min	Typical	Max	Unit
Supply Voltage	VDD	2.7	-	5.5	V
Operating Temperature	Toper	-40	-	85	掳C
Storage Temperature	Tstg	-65	-	150	掳C
Output Current (Sink)	IOL	-	10	20	mA
Output Current (Source)	IOH	-	5	10	mA
Input Leakage Current	IIH	-	1	5	渭A
Output Low Voltage	VOL	0.1	-	0.4	V
Output High Voltage	VOH	2.4	-	VDD-0.1	V
Propagation Delay Time	tpd	-	5	10	ns
Power Dissipation	PD	-	-	200	mW

Instructions for Using TSB81BA3E:

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the range of 2.7V to 5.5V.
   • Connect the VDD pin to the power supply and GND pin to ground.

2. Temperature Considerations:

   • The operating temperature range is from -40掳C to 85掳C.
   • Store the device in temperatures ranging from -65掳C to 150掳C.

3. Output Current:

   • The device can sink up to 20mA and source up to 10mA.
   • Ensure that the load does not exceed these current limits to avoid damage.

4. Input Leakage Current:

   • The input leakage current is typically 1渭A and should not exceed 5渭A.
   • Use appropriate pull-up or pull-down resistors if necessary to ensure stable input levels.

5. Output Voltage Levels:

   • When the output is low, the voltage (VOL) will be between 0.1V and 0.4V.
   • When the output is high, the voltage (VOH) will be between 2.4V and VDD - 0.1V.

6. Propagation Delay:

   • The propagation delay time (tpd) is typically 5ns and should not exceed 10ns.
   • This delay is crucial for timing considerations in your circuit design.

7. Power Dissipation:

   • The maximum power dissipation (PD) is 200mW.
   • Ensure adequate heat dissipation if the device is expected to operate near this limit.

8. Handling and Storage:

   • Handle the device with care to avoid static discharge.
   • Store in a dry environment to prevent moisture damage.

9. Mounting:

   • Follow the recommended PCB layout guidelines to ensure proper thermal management and electrical performance.
   • Use appropriate soldering techniques to avoid overheating during assembly.

(For reference only)