Details
BUY BP5221A https://www.utsource.net/itm/p/12608501.html
| Parameter | Symbol | Min | Typical | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Input Voltage | VIN | 2.7 | - | 5.5 | V | |
| Output Voltage | VOUT | - | 3.3 | - | V | Fixed |
| Output Current | IOUT | - | 500 | 600 | mA | |
| Quiescent Current | IQ | - | 30 | - | 渭A | |
| Dropout Voltage | VDROPOUT | - | 250 | - | mV | @ IOUT = 500mA |
| Load Regulation | - | - | 0.2 | - | % | 0mA to 500mA |
| Line Regulation | - | - | 0.1 | - | %/V | 2.7V to 5.5V |
| PSRR (Power Supply Rejection Ratio) | - | - | 70 | - | dB | @ 1kHz |
| Operating Temperature | Toper | -40 | - | 85 | 掳C | |
| Storage Temperature | Tstg | -55 | - | 150 | 掳C |
Instructions for Use
Input Connection:
- Connect the input voltage (VIN) to the positive terminal of the power supply.
- Ensure the input voltage is within the specified range (2.7V to 5.5V).
Output Connection:
- Connect the output voltage (VOUT) to the load.
- The output voltage is fixed at 3.3V.
Ground Connection:
- Connect the ground (GND) of the power supply, load, and BP5221A together to ensure a common reference point.
Capacitors:
- Place a 1渭F ceramic capacitor close to the input pin (VIN) to filter out noise and stabilize the input voltage.
- Place a 1渭F ceramic capacitor close to the output pin (VOUT) to filter out noise and stabilize the output voltage.
Thermal Management:
- Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.
- The device can operate up to 85掳C, but performance may degrade at higher temperatures.
PCB Layout:
- Keep the PCB traces short and wide to minimize resistance and inductance.
- Use a ground plane to improve thermal performance and reduce noise.
Storage:
- Store the device in a dry environment to prevent moisture damage.
- The storage temperature range is from -55掳C to 150掳C.
Handling:
- Handle the device with care to avoid mechanical damage.
- Follow ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.
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